Invention Publication
- Patent Title: TECHNOLOGIES FOR COUPLING FROM PHOTONIC INTEGRATED CIRCUITS WITH AN OPTICAL ISOLATOR
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Application No.: US17561286Application Date: 2021-12-23
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Publication No.: US20230204876A1Publication Date: 2023-06-29
- Inventor: Alexander Krichevsky , Boping Xie
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
Technologies for coupling to and from a photonic integrated circuit (PIC) with an optical isolator are disclosed. In one embodiment, light beams from waveguides on a PIC die are reflected towards flat mirrors on the bottom surface of the PIC die. The flat mirrors reflect the light towards curved mirrors defined in a top surface of the PIC die, which collimate the beam and direct the collimated beams out the bottom surface of the PIC die. An optical isolator below the PIC die can allow the beams to pass while blocking beams in the opposite direction.
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