公开(公告)号：US11894474B2

公开(公告)日：2024-02-06

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Ankur Agrawal ,  Susheel Jadhav ,  Quan Tran ,  Raghuram Narayan ,  Raiyomand Aspandiar ,  Kenneth Brown ,  John Heck

IPC: H01L31/02 ,  H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L25/16 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42 ,  H01L23/538 ,  G02B6/24

CPC classification number: H01L31/02327 ,  G02B1/11 ,  G02B3/0012 ,  G02B3/0056 ,  G02B6/428 ,  H01L23/5385 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02161 ,  H01L31/1876 ,  G02B6/241

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.

公开(公告)号：US20220404474A1

公开(公告)日：2022-12-22

申请号：US17558201

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Eleanor Patricia Paras Rabadam ,  Guiyun Bai ,  Israel Petronius ,  Sushrutha Gujjula ,  Ronald L. Spreitzer ,  Kenneth Brown ,  Konstantin Matyuch ,  Boping Xie ,  Stephen Keele ,  Qifeng Wu ,  Ankur Agrawal ,  Jonathan Doylend ,  Sanjeev Gupta ,  Sam Khalili ,  Daniel Grodensky ,  Nan Kong Ng ,  Ron Friedman ,  Gal Dvoretzki

IPC: G01S7/481 ,  G01S17/931 ,  G02B6/42

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

公开(公告)号：US12148742B2

公开(公告)日：2024-11-19

申请号：US16816669

申请日：2020-03-12

Applicant: Intel Corporation

Inventor： Thomas Liljeberg ,  Andrew C. Alduino ,  Ravindranath Vithal Mahajan ,  Ling Liao ,  Kenneth Brown ,  James Jaussi ,  Bharadwaj Parthasarathy ,  Nitin A Deshpande

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H04B10/40

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

公开(公告)号：US20210288035A1

公开(公告)日：2021-09-16

申请号：US16816669

申请日：2020-03-12

Applicant: Intel Corporation

Inventor： Thomas Liljeberg ,  Andrew C. Alduino ,  Ravindranath Vithal Mahajan ,  Ling Liao ,  Kenneth Brown ,  James Jaussi ,  Bharadwaj Parthasarathy ,  Nitin A. Deshpande

IPC: H01L25/16 ,  H01L23/00 ,  G02B6/42 ,  H01L23/367 ,  H04B10/40

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.