公开(公告)号：US10224290B2

公开(公告)日：2019-03-05

申请号：US14757965

申请日：2015-12-24

申请人： Intel Corporation

发明人： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC分类号： H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/16

摘要： Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.

公开(公告)号：US10325866B2

公开(公告)日：2019-06-18

申请号：US15847193

申请日：2017-12-19

申请人： Intel Corporation

发明人： Eric Li ,  Joshua Heppner ,  Rajendra Dias ,  Mitul Modi

IPC分类号： H01L23/60 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00

摘要： Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.

公开(公告)号：US20170186697A1

公开(公告)日：2017-06-29

申请号：US14757965

申请日：2015-12-24

申请人： Intel Corporation

发明人： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/16 ,  H01L2224/73204

摘要： Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.

公开(公告)号：US20180366421A1

公开(公告)日：2018-12-20

申请号：US15847193

申请日：2017-12-19

申请人： Intel Corporation

发明人： Eric Li ,  Joshua Heppner ,  Rajendra Dias ,  Mitul Modi

IPC分类号： H01L23/60 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00

CPC分类号： H01L23/60 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/15159 ,  H01L2924/1815

摘要： Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.

公开(公告)号：US09847304B2

公开(公告)日：2017-12-19

申请号：US14998292

申请日：2015-12-24

申请人： Intel Corporation

发明人： Eric Li ,  Joshua Heppner ,  Rajendra Dias ,  Mitul Modi

IPC分类号： H01L23/60 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

CPC分类号： H01L23/60 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/15159 ,  H01L2924/1815

摘要： Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.

公开(公告)号：US20170186708A1

公开(公告)日：2017-06-29

申请号：US14998292

申请日：2015-12-24

申请人： Intel Corporation

发明人： Eric Li ,  Joshua Heppner ,  Rajendra Dias ,  Mitul Modi

IPC分类号： H01L23/60 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC分类号： H01L23/60 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/15159 ,  H01L2924/1815

摘要： Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.