公开(公告)号：US10224290B2

公开(公告)日：2019-03-05

申请号：US14757965

申请日：2015-12-24

申请人： Intel Corporation

发明人： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC分类号： H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/16

摘要： Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.

公开(公告)号：US20170186697A1

公开(公告)日：2017-06-29

申请号：US14757965

申请日：2015-12-24

申请人： Intel Corporation

发明人： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/16 ,  H01L2224/73204

摘要： Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.