公开(公告)号：US10763188B2

公开(公告)日：2020-09-01

申请号：US14998122

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas John Fitzgerald ,  Kumaran Murugesan Chakravarthy ,  Syadwad Jain ,  Wei Hu ,  Zhizhong Tang

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L23/00

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

公开(公告)号：US20170186628A1

公开(公告)日：2017-06-29

申请号：US14998122

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Aravindha R. Antoniswamy ,  Thomas John Fitzgerald ,  Kumaran Murugesan Chakravarthy ,  Syadwad Jain ,  Wei Hu ,  Zhizhong Tang

IPC: H01L21/48 ,  H01L23/367 ,  F28F21/08 ,  H01L23/373

CPC classification number: H01L23/3736 ,  H01L21/4878 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16172 ,  H01L2924/16251

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.