公开(公告)号：US10725929B2

公开(公告)日：2020-07-28

申请号：US15483741

申请日：2017-04-10

Applicant: Intel Corporation

Inventor： Jianfang Zhu ,  Cristiano J. Ferreira ,  Bo Qiu ,  Ajit Krisshna Nandyal Lakshman ,  Nikhil Talpallikar ,  Deepak Gandiga Shivakumar ,  Brandt M. Guttridge ,  Kim Pallister ,  Frank J. Soqui ,  Anand Srivatsa ,  Travis T. Schluessler ,  Abhishek R. Appu ,  Ankur N. Shah ,  Joydeep Ray ,  Altug Koker ,  Jonathan Kennedy

IPC: G06F12/00 ,  G06F13/00 ,  G06F13/28 ,  G06F12/10 ,  G06F12/0875 ,  G06F12/0811 ,  G06T1/60 ,  G06F3/06 ,  G06F12/06 ,  G06F12/02 ,  G06F12/109

Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.

公开(公告)号：US20180293173A1

公开(公告)日：2018-10-11

申请号：US15483741

申请日：2017-04-10

Applicant: Intel Corporation

Inventor： Jianfang Zhu ,  Cristiano J. Ferreira ,  Bo Qiu ,  Ajit Krisshna Nandyal Lakshman ,  Nikhil Talpallikar ,  Deepak Gandiga Shivakumar ,  Brandt M. Guttridge ,  Kim Pallister ,  Frank J. Soqui ,  Anand Srivatsa ,  Travis T. Schluessler ,  Abhishek R. Appu ,  Ankur N. Shah ,  Joydeep Ray ,  Altug Koker ,  Jonathan Kennedy

IPC: G06F12/10

Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.

公开(公告)号：US20210011853A1

公开(公告)日：2021-01-14

申请号：US16939158

申请日：2020-07-27

Applicant: Intel Corporation

Inventor： Jianfang Zhu ,  Cristiano J. Ferreira ,  Bo Qiu ,  Ajit Krisshna Nandyal Lakshman ,  Nikhil Talpallikar ,  Deepak Gandiga Shivakumar ,  Brandt M. Guttridge ,  Kim Pallister ,  Frank J. Soqui ,  Anand Srivatsa ,  Travis T. Schluessler ,  Abhishek R. Appu ,  Ankur N. Shah ,  Joydeep Ray ,  Altug Koker ,  Jonathan Kennedy

IPC: G06F12/10 ,  G06F12/0875 ,  G06F12/0811 ,  G06T1/60

Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.