Electronic device
    2.
    发明授权

    公开(公告)号:US11835805B2

    公开(公告)日:2023-12-05

    申请号:US17664387

    申请日:2022-05-20

    IPC分类号: G02F1/1333

    摘要: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

    Liquid-crystal display
    3.
    发明授权
    Liquid-crystal display 有权
    液晶显示器

    公开(公告)号:US09285637B2

    公开(公告)日:2016-03-15

    申请号:US13924978

    申请日:2013-06-24

    IPC分类号: G02F1/1339 G02F1/1335

    摘要: An embodiment of a liquid-crystal display is provided, including: a display area; and a shielding area surrounding the display area, wherein the shielding area includes: a light-shielding layer adjacent to a side of the display area; and a sealant dispensing area adjacent to a side of the light-shielding layer opposite to the display area, wherein the shielding area has a total light transmittance of less than or substantially equal to that of the shielding layer.

    摘要翻译: 提供一种液晶显示器的实施例,包括:显示区域; 以及围绕所述显示区域的屏蔽区域,其中所述屏蔽区域包括:与所述显示区域的一侧相邻的遮光层; 以及与所述遮光层的与所述显示区域相对的一侧相邻的密封剂分配区域,其中所述屏蔽区域的总透光率小于或基本上等于所述屏蔽层的透光率。

    Electronic device
    4.
    发明授权

    公开(公告)号:US11988934B2

    公开(公告)日:2024-05-21

    申请号:US17746750

    申请日:2022-05-17

    IPC分类号: G02F1/137 G02F1/1335

    摘要: An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.

    Electronic device
    5.
    发明授权

    公开(公告)号:US12044914B2

    公开(公告)日:2024-07-23

    申请号:US18384647

    申请日:2023-10-27

    IPC分类号: G02F1/1333

    摘要: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

    Electronic device and method for manufacturing the same

    公开(公告)号:US11366346B2

    公开(公告)日:2022-06-21

    申请号:US17318225

    申请日:2021-05-12

    IPC分类号: G02F1/1333

    摘要: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

    MANUFACTURING METHOD OF PACKAGE CIRCUIT

    公开(公告)号:US20220173000A1

    公开(公告)日:2022-06-02

    申请号:US17519540

    申请日:2021-11-04

    IPC分类号: H01L21/66 H01L23/00

    摘要: The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.