公开(公告)号：US11366346B2

公开(公告)日：2022-06-21

申请号：US17318225

申请日：2021-05-12

申请人： InnoLux Corporation

发明人： Wen-Cheng Huang ,  Bi-Ly Lin ,  Chia-Chun Yang ,  Ying-Jung Wu ,  Chien-Wei Tseng

IPC分类号： G02F1/1333

摘要： An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

公开(公告)号：US11835805B2

公开(公告)日：2023-12-05

申请号：US17664387

申请日：2022-05-20

申请人： InnoLux Corporation

发明人： Wen-Cheng Huang ,  Bi-Ly Lin ,  Chia-Chun Yang ,  Ying-Jung Wu ,  Chien-Wei Tseng

IPC分类号： G02F1/1333

CPC分类号： G02F1/133305 ,  G02F1/133308 ,  G02F1/133345 ,  G02F2202/28

摘要： An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.