公开(公告)号：US20150021792A1

公开(公告)日：2015-01-22

申请号：US13944927

申请日：2013-07-18

Applicant: Infineon Technologies AG

Inventor： Irmgard Escher-Poeppel ,  Eduard KNAUER ,  Thomas KUNSTMANN ,  Peter SCHERL ,  Raimund FOERG

IPC: H01L23/00 ,  H01L23/373

CPC classification number: H01L24/29 ,  H01L23/3736 ,  H01L24/27 ,  H01L24/743 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/27332 ,  H01L2224/27848 ,  H01L2224/29247 ,  H01L2224/29647 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/83011 ,  H01L2224/83065 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2224/85547 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/01001 ,  H01L2924/20106 ,  H01L2924/00

Abstract: An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.

Abstract translation: 用于制造具有通过金属层连接的两个部件的电子器件的实施例方法包括将金属层施加到每个部件并连接金属层，使得形成单个金属层。

公开(公告)号：US20150031203A1

公开(公告)日：2015-01-29

申请号：US13948208

申请日：2013-07-23

Applicant: Infineon Technologies AG

Inventor： Michael KRENZER ,  Thomas KUNSTMANN ,  Eva-Maria HESS ,  Manfred FRANK

IPC: H01L21/285 ,  H01L21/02

CPC classification number: H01L21/28506 ,  H01L21/02068 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53242 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.

Abstract translation: 一种用于处理工件的方法可以包括：提供包括第一区域和第二区域的工件; 在所述第一区域和所述第二区域上形成多孔金属层; 其中所述第一区域和所述第二区域被构造成使得所述第二区域和所述多孔金属层之间的粘合力低于所述第一区域和所述多孔金属层之间的粘合力。