公开(公告)号：US20170288130A1

公开(公告)日：2017-10-05

申请号：US15089984

申请日：2016-04-04

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Klaus Elian ,  Cyrus Ghahremani ,  Rainer Markus Schaller

IPC: H01L43/02 ,  G01R33/07 ,  H01L43/12 ,  H01L43/08 ,  H01L43/06

CPC classification number: H01L43/02 ,  G01R33/0047 ,  G01R33/07 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

公开(公告)号：US12158448B2

公开(公告)日：2024-12-03

申请号：US18050178

申请日：2022-10-27

Applicant: Infineon Technologies AG

Inventor： Derek Debie ,  Klaus Elian ,  Ludwig Heitzer ,  David Tumpold ,  Jens Pohl ,  Cyrus Ghahremani ,  Thorsten Meyer ,  Christian Geissler ,  Andreas Allmeier

IPC: G01N29/22 ,  G01N25/00 ,  G01N29/02 ,  G01N29/24

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

公开(公告)号：US10678046B2

公开(公告)日：2020-06-09

申请号：US15959628

申请日：2018-04-23

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss

IPC: G02B26/08 ,  B81B7/00 ,  B81C1/00 ,  G01S7/486 ,  G02B26/10 ,  G01S7/481 ,  G02B27/00

Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.

公开(公告)号：US10571682B2

公开(公告)日：2020-02-25

申请号：US15674149

申请日：2017-08-10

Applicant: Infineon Technologies AG

Inventor： Ludwig Heitzer ,  Derek Debie ,  Klaus Elian ,  Cyrus Ghahremani ,  Johannes Lodermeyer ,  Oskar Neuhoff ,  Johann Strasser

IPC: G02B26/08 ,  B81B7/00 ,  B81C3/00 ,  G02B26/10 ,  G01S7/481

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

公开(公告)号：US09346667B2

公开(公告)日：2016-05-24

申请号：US14287230

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl

IPC: G01L9/00 ,  H01L21/00 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81C1/0023 ,  G01L9/0042 ,  H01L41/0825 ,  H01L41/0926 ,  H01L41/0973 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract translation: 公开了传感器结构。 传感器结构可以包括用于支撑MEMS传感器的引线框架，引线框架的表面中的凹部和耦合到引线框架的表面并布置在凹部上以形成腔室的MEMS传感器。 或者，引线框架可以具有通过其形成的穿孔，并且MEMS传感器可以联接到引线框架的表面并且布置在穿孔的开口上方。

公开(公告)号：US10539779B2

公开(公告)日：2020-01-21

申请号：US15674149

申请日：2017-08-10

Applicant: Infineon Technologies AG

Inventor： Ludwig Heitzer ,  Derek Debie ,  Klaus Elian ,  Cyrus Ghahremani ,  Johannes Lodermeyer ,  Oskar Neuhoff ,  Johann Strasser

IPC: G02B26/08 ,  B81B7/00 ,  B81C3/00 ,  G02B26/10 ,  G01S7/481

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

公开(公告)号：US20250060338A1

公开(公告)日：2025-02-20

申请号：US18939121

申请日：2024-11-06

Applicant: Infineon Technologies AG

Inventor： Derek Debie ,  Klaus Elian ,  Ludwig Heitzer ,  David Tumpold ,  Jens Pohl ,  Cyrus Ghahremani ,  Thorsten Meyer ,  Christian Geissler ,  Andreas Allmeier

IPC: G01N29/22 ,  G01N25/00 ,  G01N29/02 ,  G01N29/24

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

公开(公告)号：US12228728B2

公开(公告)日：2025-02-18

申请号：US17659749

申请日：2022-04-19

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Klaus Elian ,  Cyrus Ghahremani

IPC: G02B26/08 ,  G02B7/182 ,  G02B26/10 ,  G02B27/14

Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.

公开(公告)号：US20230194478A1

公开(公告)日：2023-06-22

申请号：US18050178

申请日：2022-10-27

Applicant: Infineon Technologies AG

Inventor： Derek Debie ,  Klaus Elian ,  Ludwig Heitzer ,  David Tumpold ,  Jens Pohl ,  Cyrus Ghahremani ,  Thorsten Meyer ,  Christian Geissler ,  Andreas Allmeier

IPC: G01N29/22 ,  G01N29/02 ,  G01N25/00 ,  G01N29/24

CPC classification number: G01N29/222 ,  G01N29/02 ,  G01N25/00 ,  G01N29/2425 ,  G01N2291/021

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

公开(公告)号：US20150344294A1

公开(公告)日：2015-12-03

申请号：US14287230

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81C1/0023 ,  G01L9/0042 ,  H01L41/0825 ,  H01L41/0926 ,  H01L41/0973 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract translation: 公开了传感器结构。 传感器结构可以包括用于支撑MEMS传感器的引线框架，引线框架的表面中的凹部和耦合到引线框架的表面并布置在凹部上以形成腔室的MEMS传感器。 或者，引线框架可以具有通过其形成的穿孔，并且MEMS传感器可以联接到引线框架的表面并且布置在穿孔的开口上方。