公开(公告)号：US10806030B2

公开(公告)日：2020-10-13

申请号：US14597730

申请日：2015-01-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  Kyocera Circuit Solutions Inc.

Inventor： Jean Audet ,  Edmund D. Blackshear ,  Masahiro Fukui ,  Charles L. Reynolds ,  Kenji Terada ,  Tomoyuki Yamada

IPC: H05K1/03 ,  H01L23/498 ,  H01L23/00 ,  H01L51/44 ,  H01L51/10 ,  H01L51/52 ,  H01L23/14

Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.

公开(公告)号：US10813215B2

公开(公告)日：2020-10-20

申请号：US15068891

申请日：2016-03-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jean Audet ,  Edmund D. Blackshear ,  Masahiro Fukui ,  Charles L. Reynolds ,  Kenji Terada ,  Tomoyuki Yamada

IPC: H05K1/03 ,  H01L23/498 ,  H01L23/00 ,  H01L51/44 ,  H01L51/10 ,  H01L51/52 ,  H01L23/14

Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.

公开(公告)号：US10687420B2

公开(公告)日：2020-06-16

申请号：US15068884

申请日：2016-03-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jean Audet ,  Edmund D. Blackshear ,  Masahiro Fukui ,  Charles L. Reynolds ,  Kenji Terada ,  Tomoyuki Yamada

IPC: H05K1/03 ,  H01L23/498 ,  H01L23/00 ,  H01L51/44 ,  H01L51/10 ,  H01L51/52 ,  H01L23/14

Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.