NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT

    公开(公告)号:US20180045766A1

    公开(公告)日:2018-02-15

    申请号:US15797440

    申请日:2017-10-30

    CPC classification number: G01R29/26 G01R31/001 G01R31/3187

    Abstract: Functionality for estimating characteristics of an on-chip noise signal can be implemented on a processing module. An on-chip noise signal is determined at an on-chip determination point of a computer chip. The on-chip noise signal is converted to a frequency-varying signal using a voltage-controlled oscillator implemented on the computer chip. The frequency-varying signal is measured at an off-chip measurement point and frequency information is extracted from the frequency-varying signal. The frequency information is converted to a voltage level associated with the on-chip noise signal based on the relationship between an input voltage provided to the voltage-controlled oscillator and an output frequency generated by the voltage-controlled oscillator.

    NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT

    公开(公告)号:US20150276838A1

    公开(公告)日:2015-10-01

    申请号:US14228472

    申请日:2014-03-28

    CPC classification number: G01R29/26 G01R31/001 G01R31/3187

    Abstract: Functionality for estimating characteristics of an on-chip noise signal can be implemented on a processing module. An on-chip noise signal is determined at an on-chip determination point of a computer chip. The on-chip noise signal is converted to a frequency-varying signal using a voltage-controlled oscillator implemented on the computer chip. The frequency-varying signal is measured at an off-chip measurement point and frequency information is extracted from the frequency-varying signal. The frequency information is converted to a voltage level associated with the on-chip noise signal based on the relationship between an input voltage provided to the voltage-controlled oscillator and an output frequency generated by the voltage-controlled oscillator.

    ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT

    公开(公告)号:US20230420394A1

    公开(公告)日:2023-12-28

    申请号:US17808221

    申请日:2022-06-22

    CPC classification number: H01L23/66 H01L23/473 H01P3/16 H01L2223/6627

    Abstract: A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.

    Cooling fan coupled with a set of recirculation flaps

    公开(公告)号:US10167879B2

    公开(公告)日:2019-01-01

    申请号:US15049033

    申请日:2016-02-20

    Abstract: Disclosed aspects relate to cooling electronics. A set of recirculation flaps is coupled with a cooling fan. At least one recirculation flap has a ferrous material. In various embodiments, the set of recirculation flaps is arranged in an open position in response to air pressure from the cooling fan, and is arranged in a closed position in response to substantially no air pressure from the cooling fan. A controller is coupled with the cooling fan. The controller indicates a set of indicated positions for the set of recirculation flaps based on a tachometer value. An electromagnet is connected with the controller to position the set of recirculation flaps in the set of indicated positions using the ferrous material. In various embodiments, the electromagnet engages the ferrous material to arrange the set of recirculation flaps in an open position.

    FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL
    7.
    发明申请
    FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL 有权
    频域高速总线信号完整性一致性模型

    公开(公告)号:US20160349325A1

    公开(公告)日:2016-12-01

    申请号:US14833409

    申请日:2015-08-24

    CPC classification number: G01R31/31703 G01R31/3177 G06F13/4282

    Abstract: Embodiments of the present disclosure provide methods for using a compliance model to determine compatibility of a channel with a bus's chip I/O circuitry at its ends. The method includes identifying at least one design criteria and obtaining boundary sets of frequency domain parameters for compliant signal channels known to achieve the design criteria. In certain embodiments, the boundary sets may be derived using a genetic algorithm. The method further includes verifying whether a particular signal channel is compliant by comparing values of frequency domain parameters for the particular channel to one or more of the boundary sets of frequency domain parameters for the known compliant channels.

    Abstract translation: 本公开的实施例提供了使用符合性模型来确定信道与总线的芯片I / O电路在其端部的兼容性的方法。 该方法包括识别至少一个设计标准并获得已知达到设计标准的合格信号通道的频域参数的边界集合。 在某些实施例中,边界集可以使用遗传算法导出。 该方法还包括通过将特定信道的频域参数的值与已知的兼容信道的频域参数的一个或多个边界集合进行比较来验证特定信号信道是否顺从。

    NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT
    8.
    发明申请
    NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT 有权
    噪音调节用于片上噪声测量

    公开(公告)号:US20150276840A1

    公开(公告)日:2015-10-01

    申请号:US14299257

    申请日:2014-06-09

    CPC classification number: G01R29/26 G01R31/001 G01R31/3187

    Abstract: Functionality for estimating characteristics of an on-chip noise signal can be implemented on a processing module. An on-chip noise signal is determined at an on-chip determination point of a computer chip. The on-chip noise signal is converted to a frequency-varying signal using a voltage-controlled oscillator implemented on the computer chip. The frequency-varying signal is measured at an off-chip measurement point and frequency information is extracted from the frequency-varying signal. The frequency information is converted to a voltage level associated with the on-chip noise signal based on the relationship between an input voltage provided to the voltage-controlled oscillator and an output frequency generated by the voltage-controlled oscillator.

    Abstract translation: 用于估计片上噪声信号的特性的功能可以在处理模块上实现。 在计算机芯片的片上确定点处确定片上噪声信号。 使用在计算机芯片上实现的压控振荡器将片上噪声信号转换为频率变化信号。 在片外测量点测量频率变化信号,并从频率变化信号中提取频率信息。 基于提供给压控振荡器的输入电压与由压控振荡器产生的输出频率之间的关系,频率信息被转换为与片上噪声信号相关联的电压电平。

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