公开(公告)号：US20200185300A1

公开(公告)日：2020-06-11

申请号：US16215237

申请日：2018-12-10

Applicant: INTEL CORPORATION

Inventor： Cheng Xu ,  Zhimin Wan ,  Lingtao Liu ,  Yikang Deng ,  Junnan Zhao ,  Chandra Mohan Jha ,  Kyu-oh Lee

IPC: H01L23/367 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

公开(公告)号：US11502017B2

公开(公告)日：2022-11-15

申请号：US16215237

申请日：2018-12-10

Applicant: INTEL CORPORATION

Inventor： Cheng Xu ,  Zhimin Wan ,  Lingtao Liu ,  Yikang Deng ,  Junnan Zhao ,  Chandra Mohan Jha ,  Kyu-oh Lee

IPC: H01L23/367 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

公开(公告)号：US11432405B2

公开(公告)日：2022-08-30

申请号：US16024713

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Rahul Jain ,  Prithwish Chatterjee ,  Kyu-oh Lee

IPC: H05K1/18 ,  H01L25/16 ,  H01L49/02 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/34 ,  H05K3/46 ,  H01L23/13

Abstract: A package substrate is disclosed. The package substrate includes a substrate core, a cavity below the substrate core that extends from a surface of a first resist layer to a bottom surface of the package substrate, and a first terminal and a second terminal in the first resist layer. The package substrate also includes one or more passive components that are coupled inside the cavity to the first terminal and the second terminal.

公开(公告)号：US11387224B2

公开(公告)日：2022-07-12

申请号：US16158186

申请日：2018-10-11

Applicant: Intel Corporation

Inventor： Cheng Xu ,  Zhimin Wan ,  Yikang Deng ,  Junnan Zhao ,  Chong Zhang ,  Chandra Mohan M Jha ,  Ying Wang ,  Kyu-oh Lee

IPC: H01L23/34 ,  H01L25/18 ,  H01L23/00 ,  H01L23/538 ,  F28D20/02

Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.

公开(公告)号：US20220406512A1

公开(公告)日：2022-12-22

申请号：US17352952

申请日：2021-06-21

Applicant: Intel Corporation

Inventor： Xin Ning ,  Kyu-oh Lee ,  Brent Williams ,  Brandon C. Marin ,  Tarek A. Ibrahim ,  Krishna Bharath ,  Sai Vadlamani

IPC: H01F27/255 ,  H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F41/02

Abstract: Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.