公开(公告)号：USRE49970E1

公开(公告)日：2024-05-14

申请号：US17213981

申请日：2021-03-26

申请人： IMBERATEK, LLC

发明人： Antti Kivikero ,  Pekka Kostensalo ,  Jaakko Hekki Tapie Moisala

IPC分类号： H05K1/18 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552

CPC分类号： H05K1/18 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/31 ,  H01L24/83 ,  H01L21/4821 ,  H01L23/5386 ,  H01L23/552 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/00

摘要： Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed. An electronic module including a first wiring layer, a dielectric supporting the first wiring layer, wherein the first wiring layer is embedded in the dielectric, a component having a first surface and at least one contact terminal on the first surface, an additional passivation layer on the first surface of the component and in contact with the dielectric, a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.

公开(公告)号：USRE48539E1

公开(公告)日：2021-04-27

申请号：US15938967

申请日：2018-03-28

申请人： IMBERATEK, LLC

发明人： Antti Kivikero ,  Pekka Kostensalo ,  Jaakko Hekki Tapie Moisala

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L21/48 ,  H05K1/18

摘要： Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed.