公开(公告)号：US20230225075A1

公开(公告)日：2023-07-13

申请号：US18187686

申请日：2023-03-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lujun Zhou ,  Tao Yan ,  Guangming Zheng

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.

公开(公告)号：US20250089216A1

公开(公告)日：2025-03-13

申请号：US18956201

申请日：2024-11-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Li ,  Peiqing Lin ,  Tao Yan

IPC: H05K7/20

Abstract: A heating module, a heat dissipation apparatus, and a communication device. The heating module includes an enclosure, a first heating component, and a floating cover. The first heating component is disposed in the enclosure, the enclosure has an opening, and the floating cover has a first boss. The first boss extends into the opening. The floating cover is mounted on the enclosure via a first elastic member, and the first elastic member drives the first boss to apply first pressure to the first heating component.

公开(公告)号：US20240410658A1

公开(公告)日：2024-12-12

申请号：US18810132

申请日：2024-08-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Tao Yan ,  Sergey Khairnasov ,  Wenqiang Shi

IPC: F28D15/04

Abstract: A heat pipe includes a pipe body having a sealed cavity. A heat transfer medium and a capillary structure are disposed in the sealed cavity. The pipe body includes a first additional pipe section and a main pipe section including an evaporation section, a heat insulation section, and a condensation section. The first additional pipe section, where a first additional cavity is disposed, is connected to an end part of the evaporation section. The first additional cavity is used to accommodate all or a part of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, and when the heat pipe is mounted on a heat dissipation device that requires heat dissipation, the first additional pipe section is not in contact with a heat emitting component of the heat dissipation device.

公开(公告)号：US11812586B2

公开(公告)日：2023-11-07

申请号：US17508745

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Baosheng Li ,  Tao Yan ,  Xiaojing Hou ,  Lujun Zhou ,  Liang Zhang

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20745

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

公开(公告)号：US20230240048A1

公开(公告)日：2023-07-27

申请号：US18184479

申请日：2023-03-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lirui Jia ,  Chaorong Liu ,  Peng Jin ,  Tao Yan

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.

公开(公告)号：US20230328452A1

公开(公告)日：2023-10-12

申请号：US18042758

申请日：2021-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jinhua Liu ,  Tao Yan ,  Li Guo ,  Chien Feng Yeh ,  Ligang Yu

IPC: H04R9/06 ,  H05K1/18 ,  H04R9/02 ,  H04R9/04

CPC classification number: H04R9/06 ,  H04R9/025 ,  H04R9/046 ,  H05K1/189 ,  H04R2499/11

Abstract: This application provides an electroacoustic transducer and an electronic device, the electroacoustic transducer includes a central magnet, two side magnets, a lower electrode plate, a side electrode plate, a frame, a sound diaphragm, a voice coil, and two flexible circuit boards. The central magnet and the two side magnets are disposed on the lower electrode plate. The side electrode plate is disposed on a surface of the two side magnets which is opposite to the lower electrode plate. Two surfaces of the frame are respectively fixedly connected to the sound diaphragm and a surface of the side electrode plate which is opposite to the lower electrode plate. The voice coil is located inside the frame. The two flexible circuit boards are symmetrically distributed on a peripheral side of the voice coil, two ends of the flexible circuit board are respectively connected to the voice coil and the side electrode plate.

公开(公告)号：US20220132703A1

公开(公告)日：2022-04-28

申请号：US17508745

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Baosheng Li ,  Tao Yan ,  Xiaojing Hou ,  Lujun Zhou ,  Liang Zhang

IPC: H05K7/20

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.