公开(公告)号：US20230225075A1

公开(公告)日：2023-07-13

申请号：US18187686

申请日：2023-03-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lujun Zhou ,  Tao Yan ,  Guangming Zheng

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.

公开(公告)号：US11812586B2

公开(公告)日：2023-11-07

申请号：US17508745

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Baosheng Li ,  Tao Yan ,  Xiaojing Hou ,  Lujun Zhou ,  Liang Zhang

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20745

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

公开(公告)号：US20220132703A1

公开(公告)日：2022-04-28

申请号：US17508745

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Baosheng Li ,  Tao Yan ,  Xiaojing Hou ,  Lujun Zhou ,  Liang Zhang

IPC: H05K7/20

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.