公开(公告)号：US20250089216A1

公开(公告)日：2025-03-13

申请号：US18956201

申请日：2024-11-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Li ,  Peiqing Lin ,  Tao Yan

IPC: H05K7/20

Abstract: A heating module, a heat dissipation apparatus, and a communication device. The heating module includes an enclosure, a first heating component, and a floating cover. The first heating component is disposed in the enclosure, the enclosure has an opening, and the floating cover has a first boss. The first boss extends into the opening. The floating cover is mounted on the enclosure via a first elastic member, and the first elastic member drives the first boss to apply first pressure to the first heating component.

公开(公告)号：US20250081326A1

公开(公告)日：2025-03-06

申请号：US18950438

申请日：2024-11-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Li ,  Peiqing Lin ,  Feng Lin

IPC: H05K1/02

Abstract: A circuit board module includes a substrate, an optical module component, an elastic component, and a heat sink. The optical module component includes a housing and an optical module, the housing is arranged on a side of the substrate, a hole is provided on a side that is of the housing and that is away from the substrate, and the optical module is inserted into the housing from a first end of the housing in a first direction. A first end of the elastic component is fixedly coupled to the substrate, and a second end of the elastic component is fixedly coupled to a side that is of the housing and that faces the substrate. The heat sink is arranged on a side that is of the housing and that is away from the substrate, and the heat sink is fixedly coupled to the substrate.