公开(公告)号：US20230240048A1

公开(公告)日：2023-07-27

申请号：US18184479

申请日：2023-03-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lirui Jia ,  Chaorong Liu ,  Peng Jin ,  Tao Yan

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.