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    Apparatus and method for a waveguide polarizer comprising a series of bends
    4.
    发明授权
    Apparatus and method for a waveguide polarizer comprising a series of bends 有权

    公开(公告)号：US09690045B2

    公开(公告)日：2017-06-27

    申请号：US14231429

    申请日：2014-03-31

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Dominic John Goodwill ,  Jia Jiang

    IPC: G02B6/00 ,  G02B6/126 ,  H04B10/60 ,  G02B6/13

    CPC classification number: G02B6/126 ,  G02B6/125 ,  G02B6/13 ,  H04B10/60

    Abstract: Embodiments are provided for a waveguide polarizer comprising a series of bends. The waveguide polarizer is suitable for used in optical waveguide devices or circuits, where a polarized light is required, such as for single polarization output. The polarizer design is independent of the function of the optical devices. In an embodiment, an optical polarizer comprises an optical waveguide configured to propagate light at a designated polarization mode, and comprising a bend in a same plane of the propagated light. The bend has a geometry configured to contain in the optical waveguide the designated polarization mode of the propagated light and radiate outside the optical waveguide a second polarization mode of the propagated light.

    Automatic endless polarization controller for a silicon-on-insulator platform
    5.
    发明授权
    Automatic endless polarization controller for a silicon-on-insulator platform 有权

    公开(公告)号：US10126572B2

    公开(公告)日：2018-11-13

    申请号：US15087449

    申请日：2016-03-31

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Chunshu Zhang ,  Jia Jiang ,  Dominic John Goodwill ,  Patrick Dumais

    IPC: G02F1/01 ,  G02F1/21 ,  G02F1/225 ,  G02B6/293 ,  G02B6/27

    Abstract: A photonic platform based polarization controller providing a fixed target polarization is disclosed. The polarization controller has a polarization rotator splitter splitting the beam into first and second feeds corresponding to first and second orthogonal polarization components. A first Mach-Zehnder interferometer (MZI) stage provides a first phase delay between the first and second feeds based on a first control signal, and a first mixer mixes the first and second feeds to provide third and fourth feeds. A second MZI stage provides a second phase delay between the third and fourth feeds based on a second control signal, and a second mixer mixes the third and fourth feeds to provide fifth and sixth feeds. A third MZI stage provides a third phase delay between the fifth and sixth feeds based on a third control signal, and a third mixer mixes the fifth and sixth feeds to provide the fixed target polarization. An optical tap splits a portion of the beam.

    Apparatus and method for a waveguide polarizer comprising a series of bends
    6.
    发明授权
    Apparatus and method for a waveguide polarizer comprising a series of bends 有权

    公开(公告)号：US09658399B2

    公开(公告)日：2017-05-23

    申请号：US14231429

    申请日：2014-03-31

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Dominic John Goodwill ,  Jia Jiang

    IPC: G02B6/00 ,  G02B6/126 ,  H04B10/60 ,  G02B6/13

    Abstract: Embodiments are provided for a waveguide polarizer comprising a series of bends. The waveguide polarizer is suitable for used in optical waveguide devices or circuits, where a polarized light is required, such as for single polarization output. The polarizer design is independent of the function of the optical devices. In an embodiment, an optical polarizer comprises an optical waveguide configured to propagate light at a designated polarization mode, and comprising a bend in a same plane of the propagated light. The bend has a geometry configured to contain in the optical waveguide the designated polarization mode of the propagated light and radiate outside the optical waveguide a second polarization mode of the propagated light.

    Stacked Photonic Chip Coupler for SOI Chip-Fiber Coupling
    7.
    发明申请
    Stacked Photonic Chip Coupler for SOI Chip-Fiber Coupling 有权
    用于SOI芯片 - 光纤耦合的堆叠光子晶片耦合器

    公开(公告)号：US20160109659A1

    公开(公告)日：2016-04-21

    申请号：US14515211

    申请日：2014-10-15

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Jia Jiang

    IPC: G02B6/34 ,  H01L31/167

    CPC classification number: G02B6/34 ,  G02B6/1223 ,  G02B6/124 ,  G02B6/305 ,  G02B6/356 ,  G02B2006/12061 ,  G02B2006/12164 ,  H01L31/167 ,  H02S40/44

    Abstract: Embodiments are provided for an optical coupler created by bonded photonic chip coupler for Silicon-on-Insulator (SOI) chip-fiber coupling. System and apparatus embodiments for a bonded photonic chip coupler for SOI chip-fiber coupling provide for reduced mismatch between fiber and chip, increased coupling efficiency, and lower photonics device insertion loss. In an embodiment, an optical coupler for coupling a photonics chip to an optical fiber includes a photonic chip comprising a nano-sized photonic waveguide, photonic optical diffraction surface grating, and a first cladding covering the photonic waveguide and the photonic grating; and an optical coupling chip comprising a micron-sized coupling waveguide and a coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, wherein the first coupling cladding is connected to the first cladding, wherein the optical coupling chip is configured to couple to light transmitted between the photonic chip and an optical fiber.

    Abstract translation: 提供了用于由绝缘体上硅绝缘体（SOI）芯片 - 光纤耦合的键合光子芯片耦合器产生的光耦合器的实施例。 用于SOI芯片 - 光纤耦合的粘合光子芯片耦合器的系统和装置实施例提供了光纤和芯片之间的减少的失配，增加的耦合效率和较低的光子器件插入损耗。 在一个实施例中，用于将光子芯片耦合到光纤的光耦合器包括包括纳米尺寸的光子波导，光子光学衍射表面光栅和覆盖光子波导和光子光栅的第一覆层的光子芯片; 以及光耦合芯片，其包括微米尺寸的耦合波导和嵌入在第一耦合包层和第二耦合包层上的耦合光学衍射表面光栅，其中所述第一耦合包层连接到所述第一包层，其中所述光耦合芯片是 被配置为耦合到在光子芯片和光纤之间传输的光。

    Three-Dimensional (3D) Photonic Chip-to-Fiber Interposer
    9.
    发明申请
    Three-Dimensional (3D) Photonic Chip-to-Fiber Interposer 有权
    三维（3D）光子芯片到光纤插入器

    公开(公告)号：US20160327749A1

    公开(公告)日：2016-11-10

    申请号：US14703229

    申请日：2015-05-04

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Jia Jiang

    IPC: G02B6/30

    CPC classification number: G02B6/1342 ,  C23C14/042 ,  C23C14/18 ,  C23C14/48 ,  C23C14/541 ,  C23C14/542 ,  C23C14/584 ,  C23C14/5873 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/26 ,  G02B6/305 ,  G02B6/36 ,  G02B6/423

    Abstract: A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.

    Abstract translation: 一种制造光耦合器件的方法，包括在衬底平台上形成波导掩模层，其中所述波导掩模层包括开口阵列，所述开口阵列包括与所述第一端相对的第一端和第二端，将所述衬底平台浸入 包含离子的盐熔体通过离子扩散过程在衬底平台中形成波导阵列，并且控制浸入速率使得离子的扩散深度随着从第一端到第二端的方向的距离的函数而变化 第二端，其中所述波导阵列在从所述第一端到所述第二端的方向上延伸。

    Stacked photonic chip coupler for SOI chip-fiber coupling
    10.
    发明授权
    Stacked photonic chip coupler for SOI chip-fiber coupling 有权
    用于SOI芯片 - 光纤耦合的堆叠光子芯片耦合器

    公开(公告)号：US09435961B2

    公开(公告)日：2016-09-06

    申请号：US14515211

    申请日：2014-10-15

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Jia Jiang

    IPC: G02B6/12 ,  G02B6/34 ,  H01L31/167

    CPC classification number: G02B6/34 ,  G02B6/1223 ,  G02B6/124 ,  G02B6/305 ,  G02B6/356 ,  G02B2006/12061 ,  G02B2006/12164 ,  H01L31/167 ,  H02S40/44

    Abstract: Embodiments are provided for an optical coupler created by bonded photonic chip coupler for Silicon-on-Insulator (SOI) chip-fiber coupling. System and apparatus embodiments for a bonded photonic chip coupler for SOI chip-fiber coupling provide for reduced mismatch between fiber and chip, increased coupling efficiency, and lower photonics device insertion loss. In an embodiment, an optical coupler for coupling a photonics chip to an optical fiber includes a photonic chip comprising a nano-sized photonic waveguide, photonic optical diffraction surface grating, and a first cladding covering the photonic waveguide and the photonic grating; and an optical coupling chip comprising a micron-sized coupling waveguide and a coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, wherein the first coupling cladding is connected to the first cladding, wherein the optical coupling chip is configured to couple to light transmitted between the photonic chip and an optical fiber.

    Abstract translation: 提供了用于由绝缘体上硅绝缘体（SOI）芯片 - 光纤耦合的键合光子芯片耦合器产生的光耦合器的实施例。 用于SOI芯片 - 光纤耦合的粘合光子芯片耦合器的系统和装置实施例提供了光纤和芯片之间的减少的失配，增加的耦合效率和较低的光子器件插入损耗。 在一个实施例中，用于将光子芯片耦合到光纤的光耦合器包括包括纳米尺寸的光子波导，光子光学衍射表面光栅和覆盖光子波导和光子光栅的第一覆层的光子芯片; 以及光耦合芯片，其包括微米尺寸的耦合波导和嵌入在第一耦合包层和第二耦合包层上的耦合光学衍射表面光栅，其中所述第一耦合包层连接到所述第一包层，其中所述光耦合芯片是 被配置为耦合到在光子芯片和光纤之间传输的光。

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