公开(公告)号：US20240138103A1

公开(公告)日：2024-04-25

申请号：US18491585

申请日：2023-10-19

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Qiang Gao ,  Longhe Wei ,  Yongqi Qiu ,  Jihui Liu ,  Xinquan Huang

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0203 ,  H05K7/20263 ,  H05K2201/064

Abstract: An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.

公开(公告)号：US20240237276A9

公开(公告)日：2024-07-11

申请号：US18491585

申请日：2023-10-20

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Qiang Gao ,  Longhe Wei ,  Yongqi Qiu ,  Jihui Liu ,  Xinquan Huang

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0203 ,  H05K7/20263 ,  H05K2201/064

Abstract: An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.