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公开(公告)号：US12120855B2
公开(公告)日：2024-10-15
申请号：US17964120
申请日：2022-10-12
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A cooling apparatus includes a housing, a cooling air duct, and an adsorption refrigeration unit. The housing includes a plurality of sidewalls, and the plurality of sidewalls form an inner cavity. The cooling air duct passes through the inner cavity. The adsorption refrigeration unit includes an adsorption bed, a flash evaporator, and an air cooler, the flash evaporator is connected to the air cooler, both the flash evaporator and the air cooler are disposed in the inner cavity, and the air cooler is located on a path of the cooling air duct. At least one of the plurality of sidewalls is a refrigeration sidewall, the refrigeration sidewall includes an internal wall plate and an external wall plate, the internal wall plate and the external wall plate are spaced apart and form sealed space, the sealed space is connected to the flash evaporator.
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公开(公告)号：US20240237276A9
公开(公告)日：2024-07-11
申请号：US18491585
申请日：2023-10-20
发明人： Qiang Gao , Longhe Wei , Yongqi Qiu , Jihui Liu , Xinquan Huang
CPC分类号： H05K7/20254 , H05K1/0203 , H05K7/20263 , H05K2201/064
摘要： An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.
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公开(公告)号：US20240138103A1
公开(公告)日：2024-04-25
申请号：US18491585
申请日：2023-10-19
发明人： Qiang Gao , Longhe Wei , Yongqi Qiu , Jihui Liu , Xinquan Huang
CPC分类号： H05K7/20254 , H05K1/0203 , H05K7/20263 , H05K2201/064
摘要： An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.
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