公开(公告)号：US12097657B2

公开(公告)日：2024-09-24

申请号：US16781693

申请日：2020-02-04

Applicant: Howmedica Osteonics Corp.

Inventor： Thomas Francis McCarthy ,  Brock Miller ,  Robin Stamp ,  Yuri Zaitsev ,  Robert W. Klein ,  Marc Esformes ,  David Markel ,  Amit Mistry ,  Joseph Robinson

IPC: A61L27/56 ,  A61F2/00 ,  A61F2/30 ,  B22F3/105 ,  B22F3/11 ,  B22F10/28 ,  B22F10/366 ,  B23K26/342 ,  B28B1/00 ,  B29C64/135 ,  B29C64/153 ,  B33Y10/00 ,  B22F10/38 ,  B29L31/00 ,  B33Y80/00

CPC classification number: B29C64/135 ,  A61F2/0063 ,  A61L27/56 ,  B22F3/105 ,  B22F3/1103 ,  B22F10/28 ,  B22F10/366 ,  B23K26/342 ,  B28B1/001 ,  B29C64/153 ,  A61F2002/0068 ,  A61F2002/30914 ,  A61F2002/30915 ,  B22F10/38 ,  B29L2031/772 ,  B33Y10/00 ,  B33Y80/00 ,  Y02P10/25

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.

公开(公告)号：US20170165790A1

公开(公告)日：2017-06-15

申请号：US14969695

申请日：2015-12-15

Applicant: Howmedica Osteonics Corp.

Inventor： Thomas Francis McCarthy ,  Brock Miller ,  Robin Stamp ,  Yuri Zaitsev ,  Robert Klein ,  Mark Esformes ,  David Markel ,  Amit Mistry ,  Joseph Robinson

IPC: B23K26/342 ,  B28B1/00 ,  B29C67/00

CPC classification number: B23K26/342 ,  A61F2/0063 ,  A61L27/56 ,  B22F3/1055 ,  B22F3/1103 ,  B28B1/001 ,  B29C64/135 ,  B29C64/153 ,  B29L2031/772 ,  B33Y10/00 ,  B33Y80/00 ,  Y02P10/295

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.

公开(公告)号：US20250058514A1

公开(公告)日：2025-02-20

申请号：US18813228

申请日：2024-08-23

Applicant: Howmedica Osteonics Corp.

Inventor： Thomas Francis McCarthy ,  Brock Miller ,  Robin Stamp ,  Yuri Zaitsev ,  Robert W. Klein ,  Marc Esformes ,  David Markel ,  Amit Mistry ,  Joseph Robinson

IPC: B29C64/135 ,  A61F2/00 ,  A61F2/30 ,  A61L27/56 ,  B22F3/105 ,  B22F3/11 ,  B22F10/28 ,  B22F10/366 ,  B22F10/38 ,  B23K26/342 ,  B28B1/00 ,  B29C64/153 ,  B29L31/00 ,  B33Y10/00 ,  B33Y80/00

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.

公开(公告)号：US20200171605A1

公开(公告)日：2020-06-04

申请号：US16781693

申请日：2020-02-04

Applicant: Howmedica Osteonics Corp.

Inventor： Thomas Francis McCarthy ,  Brock Miller ,  Robin Stamp ,  Yuri Zaitsev ,  Robert W. Klein ,  Marc Esformes ,  David Markel ,  Amit Mistry ,  Joseph Robinson

IPC: B23K26/342 ,  A61F2/00 ,  B29C64/135 ,  B22F3/105 ,  B22F3/11 ,  A61L27/56 ,  B29C64/153 ,  B28B1/00

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.

公开(公告)号：US10596660B2

公开(公告)日：2020-03-24

申请号：US14969695

申请日：2015-12-15

Applicant: Howmedica Osteonics Corp.

Inventor： Thomas Francis McCarthy ,  Brock Miller ,  Robin Stamp ,  Yuri Zaitsev ,  Robert Klein ,  Mark Esformes ,  David Markel ,  Amit Mistry ,  Joseph Robinson

IPC: B23K26/342 ,  B23K1/00 ,  B29C67/00 ,  B29C64/153 ,  A61L27/56 ,  B22F3/11 ,  B22F3/105 ,  B29C64/135 ,  A61F2/00 ,  B28B1/00 ,  B33Y80/00 ,  B33Y10/00 ,  B29L31/00

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.