Remotely Operated Pneumatic Manipulator Based On Kinect

    公开(公告)号:US20210354298A1

    公开(公告)日:2021-11-18

    申请号:US16874704

    申请日:2020-05-15

    IPC分类号: B25J9/16 B25J9/14 B25J15/10

    摘要: The invention disclosure a remotely operated pneumatic manipulator based on Kinect, comprising Kinect sensor, computer, D/A embedded board, PWM piezoelectric pneumatic ratio valve, pneumatic triad, air compressor, artificial muscle, spring and finger joint, wherein the Kinect sensor is provided on one side of the finger joint, a camera module of the Kinect sensor is faced to the finger joint. The pneumatic humanoid manipulator of the invention has basically the same dimensions as human hands, can achieve human-computer interaction and remotely operation, the transmission structure thereof is novel, simple and compact, the fingers thereon are convenient to control and flexible to move, the finger movement range is large for wide application, moreover, the PWM piezoelectric pneumatic ratio valve is with advantages of fast dynamic response, low cost, strong resistance to noise, and high detection accuracy of Kinect sensor.

    MEMS vascular sensor
    5.
    发明申请
    MEMS vascular sensor 有权
    MEMS血管传感器

    公开(公告)号:US20060081064A1

    公开(公告)日:2006-04-20

    申请号:US11196849

    申请日:2005-08-04

    IPC分类号: G01N3/24

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MICROFABRICATION TECHNOLOGY FOR PRODUCING SENSING CELLS FOR MOLECULAR ELECTRONIC TRANSDUCER BASED SEISMOMETER
    7.
    发明申请
    MICROFABRICATION TECHNOLOGY FOR PRODUCING SENSING CELLS FOR MOLECULAR ELECTRONIC TRANSDUCER BASED SEISMOMETER 审中-公开
    用于生产用于分子式电子传感器的地震仪的感应电池的微生物技术

    公开(公告)号:US20160291176A1

    公开(公告)日:2016-10-06

    申请号:US15037449

    申请日:2014-11-20

    申请人: Hongyu Yu Hai Huang

    发明人: Hongyu Yu Hai Huang

    IPC分类号: G01V1/18 G01H11/06 G01P13/00

    CPC分类号: G01V1/18 G01H11/06 G01P13/00

    摘要: The invention relates to microfabrication technology for producing sensing cells, for use, for example, in molecular electronic transducer (MET) based seismometers devices. In some aspects, a method for fabricating a sensing element is provided. The method includes providing a first wafer including a first substrate, a second substrate, and a first insulating layer between therebetween, etching a first fluid throughhole through the first substrate, the first insulating layer, and the second substrate, and coating the first substrate and second substrate with a first and second conductive coating, respectively. The method also includes providing a second wafer including a third substrate, a fourth substrate, and a second insulating layer therebetween, etching a second fluid throughhole through the third substrate, the second insulating layer, and the fourth substrate, and coating the third substrate with a third conductive coating from top and the fourth substrate with a fourth conductive coating from back.

    摘要翻译: 本发明涉及用于生产感测单元的微细加工技术,其用于例如基于分子电子换能器(MET)的地震仪装置中。 在一些方面,提供了一种用于制造感测元件的方法。 该方法包括提供包括第一衬底,第二衬底和第二衬底之间的第一绝缘层的第一晶片,通过第一衬底,第一绝缘层和第二衬底蚀刻第一流体通孔,以及涂覆第一衬底和 第二基板分别具有第一和第二导电涂层。 该方法还包括提供包括第三衬底,第四衬底和第二绝缘层的第二晶片,通过第三衬底,第二绝缘层和第四衬底蚀刻第二流体通孔,并且用第 来自顶部和第四基底的第三导电涂层,其后面具有第四导电涂层。

    MEMS VASCULAR SENSOR
    8.
    发明申请
    MEMS VASCULAR SENSOR 审中-公开
    MEMS血管传感器

    公开(公告)号:US20120215121A1

    公开(公告)日:2012-08-23

    申请号:US13461716

    申请日:2012-05-01

    IPC分类号: A61B5/027

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MEMS Vascular Sensor
    10.
    发明申请
    MEMS Vascular Sensor 有权
    MEMS血管传感器

    公开(公告)号:US20080210543A1

    公开(公告)日:2008-09-04

    申请号:US12041577

    申请日:2008-03-03

    IPC分类号: C23C14/34

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。