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    Equipment for and method of detecting faults in semiconductor integrated circuits
    1.
    发明授权
    Equipment for and method of detecting faults in semiconductor integrated circuits 失效
    半导体集成电路故障检测设备及检测方法

    公开(公告)号：US07222026B2

    公开(公告)日：2007-05-22

    申请号：US10107297

    申请日：2002-03-28

    申请人： Hiroshi Matsushita ,  Kunihiro Mitsutake ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Kunihiro Mitsutake ,  Yukihiro Ushiku

    IPC分类号： G01B5/28

    CPC分类号： G01N21/95607 ,  G01R31/2831

    摘要： An equipment for detecting faults in semiconductor integrated circuits includes a fault input unit to input fault information for the integrated circuits formed on a semiconductor wafer, a superimposing unit to superimpose the fault information with repeating units within the surface of the semiconductor wafer, and a first characteristic factor calculation unit to calculate a first characteristic factor showing a degree to which faults are repeated every repeating unit.

    摘要翻译： 用于检测半导体集成电路中的故障的设备包括：故障输入单元，用于输入形成在半导体晶片上的集成电路的故障信息;叠加单元，用于在半导体晶片的表面内叠加具有重复单元的故障信息;以及第一 特征因子计算单元，计算表示每个重复单元重复故障的程度的第一特征因子。

    System and method for monitoring manufacturing apparatuses
    3.
    发明授权
    System and method for monitoring manufacturing apparatuses 失效
    用于监控制造装置的系统和方法

    公开(公告)号：US07221991B2

    公开(公告)日：2007-05-22

    申请号：US11068778

    申请日：2005-03-02

    申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： G06F19/00

    CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

    摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

    摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

    System and method for controlling manufacturing apparatuses
    6.
    发明申请
    System and method for controlling manufacturing apparatuses 失效
    用于控制制造装置的系统和方法

    公开(公告)号：US20050194590A1

    公开(公告)日：2005-09-08

    申请号：US11068778

    申请日：2005-03-02

    申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/02 ,  H01L23/58

    CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

    摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

    摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

    DEFECT ANALYSIS METHOD OF SEMICONDUCTOR DEVICE
    8.
    发明申请
    DEFECT ANALYSIS METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件缺陷分析方法

    公开(公告)号：US20120029679A1

    公开(公告)日：2012-02-02

    申请号：US13177127

    申请日：2011-07-06

    申请人： Hiroshi Matsushita

    发明人： Hiroshi Matsushita

    IPC分类号： G06F19/00

    CPC分类号： H01L22/20 ,  H01L22/12

    摘要： A defect analysis method of semiconductor device, wherein defect percentage data for each of inspection units within a wafer and information pieces regarding manufacturing conditions for the wafer are loaded into a computer; statistical testing of the defect percentage data with respect to the manufacturing conditions is performed using the computer; and results of the statistical testing are collected for each of the information pieces on the manufacturing conditions and outputted from the computer.

    摘要翻译： 半导体器件的缺陷分析方法，其中晶片内的每个检查单元的缺陷百分比数据和关于晶片的制造条件的信息片被加载到计算机中; 使用计算机进行关于制造条件的缺陷百分比数据的统计测试; 并且对于制造条件的每个信息收集统计测试的结果并从计算机输出。

    Method and system for managing semiconductor manufacturing device
    9.
    发明申请
    Method and system for managing semiconductor manufacturing device 审中-公开
    用于管理半导体制造装置的方法和系统

    公开(公告)号：US20110245956A1

    公开(公告)日：2011-10-06

    申请号：US13067542

    申请日：2011-06-08

    申请人： Hiroshi Matsushita ,  Junji Sugamoto ,  Masafumi Asano

    发明人： Hiroshi Matsushita ,  Junji Sugamoto ,  Masafumi Asano

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32179 ,  G05B2219/32221 ,  G05B2219/45031 ,  Y02P90/22

    摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

    摘要翻译： 管理系统包括设定质量控制值变化的可变周期的可变周期设定部。 然后，检索单元检索夹着可变周期的事件。 这些事件可以是半导体制造装置的维护和/或校正值的改变。 分析周期设定单元设定用于分析由检索单元检索的事件之间的质量控制值的变化原因的分析期间。

    Management system of semiconductor fabrication apparatus, abnormality factor extraction method of semiconductor fabrication apparatus, and management method of the same
    10.
    发明授权
    Management system of semiconductor fabrication apparatus, abnormality factor extraction method of semiconductor fabrication apparatus, and management method of the same 失效
    半导体制造装置的管理系统，半导体制造装置的异常因子提取方法及其管理方法

    公开(公告)号：US07742834B2

    公开(公告)日：2010-06-22

    申请号：US11727824

    申请日：2007-03-28

    申请人： Hiroshi Matsushita ,  Junji Sugamoto ,  Masafumi Asano

    发明人： Hiroshi Matsushita ,  Junji Sugamoto ,  Masafumi Asano

    IPC分类号： G06F19/00 ,  G05B13/02 ,  H01L21/00 ,  G01N37/00

    CPC分类号： G05B19/41875 ,  G05B2219/32075 ,  G05B2219/32222 ,  G05B2219/45031 ,  Y02P90/22

    摘要： According to the present, there is proved a semiconductor fabrication apparatus management system having:a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device;a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data;an apparatus parameter storage unit which stores the apparatus parameters;a dimensional data storage unit which stores the dimensional data;an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; andan abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculated correlation coefficient.

    摘要翻译： 根据现在，已经证明了一种半导体制造装置管理系统，其具有：监视并输出制造半导体装置的半导体制造装置的多个装置参数的传感器; 测量单元，其测量半导体器件的尺寸值，并将该尺寸值作为尺寸数据输出; 装置参数存储单元，其存储所述装置参数; 存储尺寸数据的尺寸数据存储单元; 装置参数控制器，其通过从所述尺寸数据存储单元提取所述尺寸数据来计算预测尺寸数据，并且基于所述预测尺寸数据来控制所述多个装置参数中的至少一个; 以及异常因子提取单元，其分析受控设备参数和其他设备参数之间的相关性，并且基于计算的相关系数提取异常设备参数。