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公开(公告)号:US20200172440A1
公开(公告)日:2020-06-04
申请号:US16629778
申请日:2018-04-18
发明人: Markus SCHEIBEL
IPC分类号: C04B28/34 , C04B14/04 , C04B24/12 , C04B24/06 , H01L23/29 , H05K5/06 , H01L21/56 , B28B1/24 , B28B11/24
摘要: A composition consisting essentially of (a) 1 to 30 wt. % of a hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; (b) 1 to 40 wt. % of a compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; (c) 40 to 95 wt. % of a particulate filler selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminium; calcium sulfate; barium sulfate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt. % of a constituent that differs from constituents (a) to (c).
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公开(公告)号:US20220315491A1
公开(公告)日:2022-10-06
申请号:US17844261
申请日:2022-06-20
发明人: Markus SCHEIBEL
IPC分类号: C04B28/34 , B28B1/24 , B28B11/24 , C04B14/04 , C04B24/06 , C04B24/12 , H01L21/56 , H01L23/29 , H05K5/06 , C04B12/02
摘要: A composition is provided. The composition consists essentially of (a) 1 to 30 wt. % of a hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; (b) 1 to 40 wt. % of a compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; (c) 40 to 95 wt. % of a particulate filler selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminum; calcium sulfate; barium sulfate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide; aluminum oxide; silicon dioxide; silicon carbide; aluminum nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt. % of a constituent that differs from constituents (a) to (c).
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公开(公告)号:US20210087111A1
公开(公告)日:2021-03-25
申请号:US16629839
申请日:2018-03-02
发明人: Markus SCHEIBEL , Tamara DRASKOVIC
摘要: A composition consisting essentially of (a) 1 to 30% by weight of a 1 to 90% by weight aqueous phosphoric acid and/or a hydrogen phosphate; (b) 1 to 40% by weight of a compound selected from the group of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95% by weight of a particulate filler selected from the group of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide, aluminium oxide; silicon oxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; (d) 1 to 10% by weight of an urea compound selected from the group consisting of imidazolidine-2-on, allantoin and imidazolidinyl urea; and (e) 0 to 15% by weight of a component differing from (a) to (d).
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公开(公告)号:US20240025148A1
公开(公告)日:2024-01-25
申请号:US18044155
申请日:2021-09-01
CPC分类号: B32B13/06 , B32B15/20 , B32B13/02 , B32B37/15 , B32B2307/7376 , B32B2457/00 , B32B2311/12 , B32B2315/06 , B32B2250/42 , B32B2264/1021 , B32B2264/1023 , B32B2309/02
摘要: Laminar structure comprising two outwardly facing metal layers with an interposed alternating layer sequence made up of n layers of a hydraulically cured inorganic cement composition and n−1 metal layers, where n=1, 2, or 3.
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5.
公开(公告)号:US20240006191A1
公开(公告)日:2024-01-04
申请号:US18255299
申请日:2020-12-23
发明人: Markus SCHEIBEL , Stefan MAUSNER , Sungsig KANG , Martin SATTLER , Anton-Zoran MIRIC , Li-San CHAN
CPC分类号: H01L21/568 , C04B28/04 , C04B28/06 , C04B28/105 , H01L23/291 , C04B2111/00844
摘要: A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).
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