METHOD OF FORMING A MAGNETIC WRITE HEAD
    1.
    发明申请
    METHOD OF FORMING A MAGNETIC WRITE HEAD 有权
    形成磁头的方法

    公开(公告)号:US20160225391A1

    公开(公告)日:2016-08-04

    申请号:US14608586

    申请日:2015-01-29

    CPC classification number: G11B5/3123 G11B5/17 G11B5/3906 G11B2005/0021

    Abstract: A magnetic write head has a plated coil with narrow pitch and is suitable for writing at high frequencies on magnetic media with high coercivity. The narrow pitch is obtained without such disadvantages as overplating that has adversely affected prior art attempts to produce such narrow pitches. The process that produces the magnetic write head is characterized by an RIE plasma etch using O2/N2 to etch plating trenches into a baked layer of photoresist with the ratio of gases being 5/45 sccm so that a dilute O2 concentration does not create unwanted side etching of the plating trenches. In addition, a Cu seed layer is coated with an insulating layer of Al2O3 which redeposits on the trench sidewalls to inhibit redeposition of any Cu from the seed layer and prevent outward growth of the plated Cu that would result in overplating.

    Abstract translation: 磁写头具有窄间距的电镀线圈,适用于高矫顽磁性介质的高频写入。 获得窄的间距没有诸如对现有技术尝试产生这种窄间距产生不利影响的过度镀敷的缺点。 产生磁写头的过程的特征在于使用O 2 / N 2的RIE等离子体蚀刻将电镀沟槽蚀刻成光致抗蚀剂的烘烤层,其中气体比例为5/45sccm,使得稀的O 2浓度不会产生不期望的侧面 蚀刻电镀槽。 此外,Cu籽晶层涂覆有Al 2 O 3的绝缘层,其重新沉积在沟槽侧壁上以抑制任何Cu从种子层的再沉积,并防止导致过镀的镀覆Cu的向外生长。

    Method of forming a magnetic write head
    2.
    发明授权
    Method of forming a magnetic write head 有权
    形成磁写头的方法

    公开(公告)号:US09412397B1

    公开(公告)日:2016-08-09

    申请号:US14608586

    申请日:2015-01-29

    CPC classification number: G11B5/3123 G11B5/17 G11B5/3906 G11B2005/0021

    Abstract: A magnetic write head has a plated coil with narrow pitch and is suitable for writing at high frequencies on magnetic media with high coercivity. The narrow pitch is obtained without such disadvantages as overplating that has adversely affected prior art attempts to produce such narrow pitches. The process that produces the magnetic write head is characterized by an RIE plasma etch using O2/N2 to etch plating trenches into a baked layer of photoresist with the ratio of gases being 5/45 sccm so that a dilute O2 concentration does not create unwanted side etching of the plating trenches. In addition, a Cu seed layer is coated with an insulating layer of Al2O3 which redeposits on the trench sidewalls to inhibit redeposition of any Cu from the seed layer and prevent outward growth of the plated Cu that would result in overplating.

    Abstract translation: 磁写头具有窄间距的电镀线圈,适用于高矫顽磁性介质的高频写入。 获得窄的间距没有诸如对现有技术尝试产生这种窄间距产生不利影响的过度镀敷的缺点。 产生磁写头的过程的特征在于使用O 2 / N 2的RIE等离子体蚀刻将电镀沟槽蚀刻成光致抗蚀剂的烘烤层,其中气体比例为5/45sccm,使得稀的O 2浓度不会产生不期望的侧面 蚀刻电镀槽。 此外,Cu籽晶层涂覆有Al 2 O 3的绝缘层,其重新沉积在沟槽侧壁上以抑制任何Cu从种子层的再沉积,并防止导致过镀的镀覆Cu的向外生长。

    Resist Reactive Ion Etch (RIE) Process for Plating
    5.
    发明申请
    Resist Reactive Ion Etch (RIE) Process for Plating 审中-公开
    电镀反应离子蚀刻(RIE)工艺

    公开(公告)号:US20170011756A1

    公开(公告)日:2017-01-12

    申请号:US15222431

    申请日:2016-07-28

    CPC classification number: G11B5/3123 G11B5/17 G11B5/3906 G11B2005/0021

    Abstract: A magnetic write head has a plated coil with narrow pitch and is suitable for writing at high frequencies on magnetic media with high coercivity. The narrow pitch is obtained without such disadvantages as overplating that has adversely affected prior art attempts to produce such narrow pitches. The process that produces the magnetic write head is characterized by an RIE plasma etch using O2/N2 to etch plating trenches into a baked layer of photoresist with the ratio of gases being 5/45 sccm so that a dilute O2 concentration does not create unwanted side etching of the plating trenches. In addition, a Cu seed layer is coated with an insulating layer of Al2O3 which redeposits on the trench sidewalls to inhibit redeposition of any Cu from the seed layer and prevent outward growth of the plated Cu that would result in overplating.

    Abstract translation: 磁写头具有窄间距的电镀线圈,适用于高矫顽磁性介质的高频写入。 获得窄的间距没有诸如对现有技术尝试产生这种窄间距产生不利影响的过度镀敷的缺点。 产生磁写头的过程的特征在于使用O 2 / N 2的RIE等离子体蚀刻将电镀沟槽蚀刻成光致抗蚀剂的烘烤层,其中气体比例为5/45sccm,使得稀的O 2浓度不会产生不期望的侧面 蚀刻电镀槽。 此外,Cu籽晶层涂覆有Al 2 O 3的绝缘层,其重新沉积在沟槽侧壁上以抑制任何Cu从种子层的再沉积,并防止导致过镀的镀覆Cu的向外生长。

    Heat sink for thermally assisted magnetic recording (TAMR)
    7.
    发明授权
    Heat sink for thermally assisted magnetic recording (TAMR) 有权
    热辅助磁记录散热器(TAMR)

    公开(公告)号:US08947986B1

    公开(公告)日:2015-02-03

    申请号:US14475861

    申请日:2014-09-03

    CPC classification number: G11B5/6088 G11B5/314 G11B2005/0021

    Abstract: A TAMR head is disclosed wherein a heat sink with a bilayer configuration surrounds the main pole. There is a planar plasmon generator (PPG) with a front peg portion and a larger back portion between a waveguide and a main pole bottom surface. The PPG generates a surface plasmon mode and heats a spot on a magnetic medium during a write process. A first heat sink layer made of Au contacts a back section of the top surface in the PPG back portion to enable efficient dissipation of heat away from the PPG. The second heat sink layer may be Ru and serves as a barrier between the main pole and first heat sink layer to prevent Au migration into magnetic material, and is thermally stable to at least 450° C. to prevent a thermal breakdown of the heat sink material in proximity to the PPG front end.

    Abstract translation: 公开了一种具有双层结构的散热器围绕主极的TAMR头。 有一个平面等离子体激元发生器(PPG),在波导和主极底面之间具有前端部分和较大的后部。 PPG在写入过程中产生表面等离子体激元模式并加热磁性介质上的光斑。 由Au制成的第一散热层与PPG背部中的顶表面的背部接触,以便能够有效地散发远离PPG的热量。 第二散热层可以是Ru并且用作主极和第一散热层之间的阻挡层,以防止Au迁移到磁性材料中,并且在至少450℃下是热稳定的,以防止散热片的热击穿 靠近PPG前端的材料。

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