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公开(公告)号：US20220128216A1
公开(公告)日：2022-04-28
申请号：US17510552
申请日：2021-10-26
发明人： Hyun Woo Kang
摘要： The present disclosure relates to a lamp for a vehicle, the lamp including: a board; a light source disposed on one surface of the board; and a reflector configured to transfer heat to the board and receive heat from the board and having a reflective surface for reflecting light emitted from the light source, thereby simplifying a structure and improving spatial utilization and a degree of design freedom.
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公开(公告)号：US11906837B2
公开(公告)日：2024-02-20
申请号：US18055329
申请日：2022-11-14
发明人： Hyun Woo Kang
IPC分类号： G02F1/1333 , H05K7/20 , G02F1/13357
CPC分类号： G02F1/133385 , G02F1/133322 , G02F1/133606 , H05K7/20963
摘要： A picture generation apparatus includes: a PCB on which one or more light sources are disposed; an LCD projecting an image using light that is emitted from the one or more light sources; a diffuser disposed between the PCB and the LCD; and a screen configured to be in contact with at least a portion of the LCD and discharge heat generated from the LCD.
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3.发明授权公开(公告)号：US12007560B2
公开(公告)日：2024-06-11
申请号：US17703309
申请日：2022-03-24
发明人： Hyun Woo Kang
CPC分类号： G02B27/0101 , G02B3/08 , G02B2027/0181 , G02B2027/0192
摘要： According to at least one aspect, the present disclosure provides a head-up display device comprising: a housing; a plurality of light sources housed at the housing and configured to emit light; a display panel configured to display an image based on the light emitted from the plurality of light sources; and a Fresnel lens configured to magnify the image displayed at the display panel. According to another aspect, the present disclosure provides a head-up display device configured to project an image on a windshield of a vehicle, comprising: a housing; a plurality of light sources housed at the housing and configured to emit light; and a display panel configured to display an image based on the light emitted from the plurality of light sources, wherein the plurality of light sources are divided into a plurality of groups, each group being supplied with a current having a mutually different magnitude.
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公开(公告)号：US11530795B2
公开(公告)日：2022-12-20
申请号：US17510552
申请日：2021-10-26
发明人： Hyun Woo Kang
摘要： The present disclosure relates to a lamp for a vehicle, the lamp including: a board; a light source disposed on one surface of the board; and a reflector configured to transfer heat to the board and receive heat from the board and having a reflective surface for reflecting light emitted from the light source, thereby simplifying a structure and improving spatial utilization and a degree of design freedom.
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公开(公告)号：US11333317B2
公开(公告)日：2022-05-17
申请号：US17344482
申请日：2021-06-10
发明人： Hyun Woo Kang
摘要： A lamp for an automobile and an automobile are disclosed. According to one aspect of the present disclosure, provided is a lamp for an automobile, the lamp including: a lens provided on the front outer side; a lens holder coupled to the lens to fix the lens; a heat dissipating module coupled to the lens holder in rear of the lens holder; a housing having a space configured to accommodate the lens, the lens holder, and the heat dissipating module, the housing having a through-hole which is provided in a rear side surface thereof and through which the heat dissipating module passes; and a sealing member provided between the heat dissipating module and the housing in the through-hole. The sealing member includes a protrusion-recess section having flexibility.
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公开(公告)号：US10948169B2
公开(公告)日：2021-03-16
申请号：US16557409
申请日：2019-08-30
发明人： Hyun Woo Kang
IPC分类号： F21V29/00 , F21V19/00 , F21V29/70 , F21S45/48 , F21S41/141
摘要： Disclosed herein is an LED lamp apparatus for a vehicle, which includes a heat sink, a printed circuit board including an electric circuit and disposed on the heat sink, an LED disposed between the heat sink and the printed circuit board, the LED being in contact with the heat sink, and an electrode binder extending to the LED through the printed circuit board and electrically connecting the printed circuit board and the LED.
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公开(公告)号：US10015883B2
公开(公告)日：2018-07-03
申请号：US14996059
申请日：2016-01-14
发明人： Hyun Woo Kang
IPC分类号： F21V19/00 , H05K1/18 , F21S41/19 , F21S41/141 , F21S43/19 , F21S43/14 , H01L25/16 , H05K1/05 , F21Y103/10
CPC分类号： H05K1/181 , F21S41/141 , F21S41/192 , F21S43/14 , F21S43/195 , F21Y2103/10 , H01L25/167 , H01L2924/0002 , H05K1/05 , H05K1/056 , H05K2201/10022 , H05K2201/10106 , H05K2201/10174 , H05K2201/10189 , H01L2924/00
摘要： Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.
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公开(公告)号：US20160212853A1
公开(公告)日：2016-07-21
申请号：US14996059
申请日：2016-01-14
发明人： Hyun Woo Kang
CPC分类号： H05K1/181 , F21S41/141 , F21S41/192 , F21S43/14 , F21S43/195 , F21Y2103/10 , H01L25/167 , H01L2924/0002 , H05K1/05 , H05K1/056 , H05K2201/10022 , H05K2201/10106 , H05K2201/10174 , H05K2201/10189 , H01L2924/00
摘要： Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.
摘要翻译： 公开了一种用于车辆灯的发光二极管（LED）封装。 LED封装包括印刷电路板（PCB），其包括金属层，形成在金属层上的绝缘层和形成在绝缘层上的电布线层; LED电路单元，其包括安装在所述电布线层上的LED芯片; 以及安装在与LED芯片连接的电布线层上的连接器。 印刷电路板的面积和厚度以及印刷电路板上的LED芯片的位置可以基于LED芯片的热阻和PCB的热阻来确定。
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公开(公告)号：US12120858B2
公开(公告)日：2024-10-15
申请号：US18348560
申请日：2023-07-07
发明人： Hyun Woo Kang
CPC分类号： H05K7/20963 , G02B27/0101 , G02B2027/0152
摘要： A picture generation apparatus using a heat sink dissipating system is disclosed. An embodiment of the present disclosure provides a picture generation apparatus including a PCB on which one or more light sources are disposed; a funnel configured to focus light of the light sources emitted from the PCB, and to reflect the focused light of the light sources to a user; and a heat sink comprising a cup-shaped accommodating part to accommodate the PCB and the funnel, and a polygonal flange part formed on an end thereof.
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公开(公告)号：US11435054B2
公开(公告)日：2022-09-06
申请号：US17398467
申请日：2021-08-10
发明人： Gil Won Han , Hyun Woo Kang
IPC分类号： F21S45/47 , F21S41/148 , F21V23/06 , B60Q1/00
摘要： The present disclosure relates to a light source module including: a heat dissipation member; a board disposed on the heat dissipation member; a light-emitting element disposed on the heat dissipation member and configured to transfer heat to the heat dissipation member; and a connection member disposed on the board and configured to electrically connect the light-emitting element and the board, thereby improving stability and reliability.
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