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公开(公告)号：US20220142010A1
公开(公告)日：2022-05-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11133239B2
公开(公告)日：2021-09-28
申请号：US16719030
申请日：2019-12-18
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yonghai Mao , Yong Yao , Guangyu Fang , Dingfang Li , Shan Lin
Abstract: In a processor fastening structure, when a compression spring (23) is compressed by shortening a distance between the other end of a screw (24) and a heat sink base (22), the compression spring (23) provides elastic force for both the screw (24) and the heat sink base (22). In addition, because the screw (24) passes through the compression spring (23) to connect to a fastening assembly (21), the elastic force of the compression spring (23) is converted into pressure from the heat sink base (22) to a CPU.
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公开(公告)号：US11839065B2
公开(公告)日：2023-12-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20254 , H05K7/20336 , H05K7/20454 , H05K7/20863
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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Patent Agency Ranking
公开(公告)号：US11073877B2
公开(公告)日：2021-07-27
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20240057300A1
公开(公告)日：2024-02-15
申请号：US18495735
申请日：2023-10-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20336 , H05K7/20454 , H05K7/20254 , H05K7/20863
Abstract: This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11726534B2
公开(公告)日：2023-08-15
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
CPC classification number: G06F1/20 , H05K7/20172 , H05K7/20318 , H05K7/20409 , G06F2200/201
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20210341977A1
公开(公告)日：2021-11-04
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20210011534A1
公开(公告)日：2021-01-14
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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