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公开(公告)号：US20220142010A1
公开(公告)日：2022-05-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11839065B2
公开(公告)日：2023-12-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20254 , H05K7/20336 , H05K7/20454 , H05K7/20863
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11073877B2
公开(公告)日：2021-07-27
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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Patent Agency Ranking
公开(公告)号：US12163566B2
公开(公告)日：2024-12-10
申请号：US17716469
申请日：2022-04-08
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhenming Hu , Jianqiang Yin , Xiaofei Li , Rucheng Zhu
Abstract: One example vibration damping bracket provided in some embodiments of this application includes a fastening bracket, a first bracket body, a second bracket body, a first vibration damping component, and a second vibration damping component. The first bracket body is elastically connected to the fastening bracket by using the first vibration damping component. The second bracket body is elastically connected to the first bracket body by using the second vibration damping component. The first vibration damping component includes a metal elastic part configured to absorb vibration, and the second vibration damping component includes a rubber elastic part configured to absorb vibration.
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公开(公告)号：US20240057300A1
公开(公告)日：2024-02-15
申请号：US18495735
申请日：2023-10-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20336 , H05K7/20454 , H05K7/20254 , H05K7/20863
Abstract: This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11726534B2
公开(公告)日：2023-08-15
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
CPC classification number: G06F1/20 , H05K7/20172 , H05K7/20318 , H05K7/20409 , G06F2200/201
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20210341977A1
公开(公告)日：2021-11-04
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20210011534A1
公开(公告)日：2021-01-14
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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