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公开(公告)号：US20220262751A1
公开(公告)日：2022-08-18
申请号：US17733132
申请日：2022-04-29
发明人： Tonglong Zhang , Xiaodong Zhang , Yong Guan , Simin Wang
摘要： A chip package on package structure includes a primary chip stack unit having pins insulated and spaced from each other on a first surface; a first bonding layer disposed on the first surface, where the first bonding layer includes bonding components insulated and spaced from each other, each bonding component includes a bonding part, and any two bonding parts are insulated and have a same cross-sectional area, and the bonding components are separately bonded to the pins; and secondary chip stack units, disposed on a surface of a side that is of the first bonding layer and that is away from the primary chip stack unit, where the secondary chip stack unit has micro bumps insulated and spaced from each other, and each of the micro bumps is bonded to one of the bonding components.
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公开(公告)号：US11652547B2
公开(公告)日：2023-05-16
申请号：US17484668
申请日：2021-09-24
发明人： Zhiping Jiang , Simin Wang
IPC分类号： H04B10/079 , H04J14/02
CPC分类号： H04B10/07953 , H04J14/021
摘要： A method to determine the types of optical fibers forming a link of an optical communication network. By scanning a signal's bit error rate at a receiver end, as a function of a pre-dispersion applied to a signal at a transmitter end, local minimums in the curve indicate the presence of amplifiers, and therefore fiber span extremities. By determining the accumulated dispersion at each fiber extremity, a ratio of dispersion per span length can be obtained and the span's coefficient of chromatic dispersion be inferred, thereby identifying the type of fiber. Alternatively, a signal's signal-to-noise ratio can be scanned, instead of its bit error rate. In a typical network, the required instrumentation is pre-existing.
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