公开(公告)号：US11362441B2

公开(公告)日：2022-06-14

申请号：US16810153

申请日：2020-03-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bruno Biscontini ,  Juan Segador Alvarez ,  Roberto Flamini ,  Vincent Mallepeyre

IPC: H01Q21/26 ,  H01Q1/24 ,  H01Q21/24 ,  H01Q19/00 ,  H01Q9/28 ,  H01Q1/38 ,  H01Q15/14

Abstract: The invention refers to a radiating element comprising a support structure, a first dipole arranged on the support structure, and at least one electrically closed ring arranged on the support structure, wherein the ring surrounds the first dipole and is galvanically isolated from the first dipole, wherein a resonance frequency of the first dipole is higher than a center frequency of an operational bandwidth of the radiating element.

公开(公告)号：US10601145B2

公开(公告)日：2020-03-24

申请号：US15979888

申请日：2018-05-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bruno Biscontini ,  Juan Segador Alvarez ,  Roberto Flamini ,  Vincent Mallepeyre

IPC: H01Q21/00 ,  H01Q21/26 ,  H01Q1/24 ,  H01Q21/24 ,  H01Q19/00 ,  H01Q9/28 ,  H01Q1/38 ,  H01Q15/14

Abstract: The present disclosure refers to a radiating element comprising a support structure, a first dipole arranged on the support structure, and at least one electrically closed ring arranged on the support structure. The at least one electrically closed ring surrounds the first dipole and is galvanically isolated from the first dipole, and a resonance frequency of the first dipole is higher than a center frequency of an operational bandwidth of the radiating element.