HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE

    公开(公告)号:US20230275003A1

    公开(公告)日:2023-08-31

    申请号:US18144580

    申请日:2023-05-08

    CPC classification number: H01L23/4006 H01L23/04 H01L2023/4087

    Abstract: A heat dissipation assembly includes: a heat spreader, configured to be in contact with an element; a frame body, configured to limit a position of the heat spreader, where the frame body surrounds a side wall of the heat spreader; and an elastic structure, fixedly connected to the frame body. In this application, the heat spreader is disposed, so that heat generated by the element can be evenly conducted; furthermore, the elastic structure fixedly connected to the frame body is disposed, so that the element, the heat spreader, and the frame body are reliably fastened in a thickness direction, to ensure that heat generated by the element can be smoothly conducted. In addition, because a requirement on adhesion strength of a heat conducting material is reduced, a heat conducting material with better heat dissipation performance can be selected, thereby further improving and heat dissipation efficiency of a chip is further improved.

    OPTICAL COMMUNICATION METHOD AND RELATED APPARATUS

    公开(公告)号:US20250070870A1

    公开(公告)日:2025-02-27

    申请号:US18944185

    申请日:2024-11-12

    Abstract: An optical communication system includes a first component, a second component, and an optical connection assembly that connects the first component and the second component. An example method includes: controlling the first component to send a first optical signal to the second component through the optical connection assembly; sending an alarm indication when it is determined, based on an optical power variation status of the first optical signal in a transmission process, that the optical connection assembly is exceptional; and when it is determined, based on the optical power variation status of the first optical signal in the transmission process, that the optical connection assembly is normal, controlling the first component to send a second optical signal to the second component, where an optical power of the second optical signal is greater than an optical power of the first optical signal.

    FLEXIBLE LIQUID COOLING HEAT DISSIPATION UNIT

    公开(公告)号:US20250048590A1

    公开(公告)日:2025-02-06

    申请号:US18926435

    申请日:2024-10-25

    Abstract: This application provides a flexible liquid cooling heat dissipation unit. The flexible liquid cooling heat dissipation unit is configured to dissipate heat for a heat generation component. A liquid inlet and a liquid outlet are provided on the flexible liquid cooling heat dissipation unit. A heat exchange cavity that is used for accommodating a coolant and allowing the coolant to flow from the liquid inlet to the liquid outlet is provided in the flexible liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit includes a flexible sheet material. The flexible sheet material is obtained by compounding a plurality of functional film layers, the plurality of functional film layers include at least one anti-penetration layer, and permeability of the anti-penetration layer is less than 1 g/m2/24 hr.

    OPTO-ELECTRONIC ADAPTER AND COMMUNICATION SYSTEM

    公开(公告)号:US20230400650A1

    公开(公告)日:2023-12-14

    申请号:US18455892

    申请日:2023-08-25

    CPC classification number: G02B6/4293 G02B6/3825 G02B6/3849

    Abstract: An optical connector has a first connection end configured to fit with a peer adapter. The electrical connector has a second connection end configured to fit with the peer adapter. The first connection end and the second connection end have a same opening direction. In addition, the first connection end may slide along a plugging direction of the peer adapter relative to the second connection end. The first connection end is configured to be connected to the peer adapter before the second connection end. The optical connector is connected to the peer adapter before the electrical connector. This ensures that a channel for transmitting an optical signal is communicated before a channel for transmitting an electrical signal is communicated, thereby avoiding fiber burning and improving security and reliability of the opto-electronic adapter during use.

    LIGHT SOURCE MODULE, OPTICAL COMMUNICATIONS BOARD, AND OPTICAL COMMUNICATIONS SYSTEM

    公开(公告)号:US20220413239A1

    公开(公告)日:2022-12-29

    申请号:US17901975

    申请日:2022-09-02

    Abstract: This application provides a light source module, an optical communications board, and an optical communications system. The light source module includes a light source emission module configured to emit a laser and a housing configured to protect the light source emission module. The light source emission module is connected to a first connector and a second connector, the first connector is an optical signal connector, and the second connector is an electrical signal connector. When the first connector and the second connector are specifically disposed, the first connector and the second connector are located on a same side of the housing. In addition, both the first connector and the second connector are pluggable connectors. When being connected to a backplane, the first connector and the second connector may be separately connected to a board body in a pluggable manner.

    ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:US20250151230A1

    公开(公告)日:2025-05-08

    申请号:US19020494

    申请日:2025-01-14

    Abstract: This application provides example electronic assemblies. One example electronic assembly includes a first heat dissipation panel, a second heat dissipation panel, and a first circuit board assembly. The first heat dissipation panel is provided with a runner. The second heat dissipation panel is fastened to the first heat dissipation panel, and encloses a working medium cavity with the first heat dissipation panel, where the working medium cavity is in communication with the runner. The first circuit board assembly includes a first circuit board, a first component, and a second component, the first component and the second component are both disposed on a same side of the first circuit board, and the first circuit board and the first heat dissipation panel are disposed in a stacked manner.

    OPTICAL MODULE, RELATED APPARATUS, AND ASSEMBLY METHOD

    公开(公告)号:US20250112702A1

    公开(公告)日:2025-04-03

    申请号:US18978449

    申请日:2024-12-12

    Abstract: Embodiments of the present invention disclose an optical module, a related apparatus, and an assembly method. in one example, an optical module includes a first circuit board, a second circuit board, and a connection board. The first circuit board includes a transmitter optical subassembly and a receiver optical subassembly. The second circuit board includes a processing unit. The first circuit board further includes a first connection port. The second circuit board further includes a second connection port. The transmitter optical subassembly and the receiver optical subassembly are separately connected to the first connection port. The processing unit is connected to the second connection port.

    COMMUNICATION DEVICE, COMMUNICATION SYSTEM, AND OPTICAL MODULE

    公开(公告)号:US20240223349A1

    公开(公告)日:2024-07-04

    申请号:US18604576

    申请日:2024-03-14

    CPC classification number: H04L7/0075

    Abstract: A communication device includes a processing module, at least one optical module, and at least one connection apparatus. Each of the at least one optical module is connected to the processing module by using a corresponding connection apparatus. The processing module is configured to:
    provide an electrical signal for each optical module, or receive an electrical signal provided by the optical module. Each optical module is configured to: convert the electrical signal provided by the processing module into an optical signal and then send the optical signal, or convert a received optical signal into an electrical signal and then provide the electrical signal for the processing module. The connection apparatus corresponding to each optical module is configured to: transmit the electrical signal provided by the processing module to each optical module, or transmit the electrical signal provided by each optical module to the processing module.

    MESSAGE NOTIFICATION METHOD AND ELECTRONIC DEVICE

    公开(公告)号:US20220174143A1

    公开(公告)日:2022-06-02

    申请号:US17674992

    申请日:2022-02-18

    Abstract: A message notification method and an electronic device are provided. When a primary screen is turned off, prompt information of a notification message is displayed on a secondary screen located right above a front-facing camera, so that a user can notice a message notification in time, and user experience is improved. A specific solution is as follows: After the primary screen is turned off, if the electronic device detects a first notification message, the electronic device displays first information on the secondary screen. The first information is used to prompt the user that the first notification message has been received. The electronic device detects a first operation in which the user indicates to turn on the primary screen. The electronic device turns on the primary screen in response to the first operation. The electronic device displays second information on the secondary screen.

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