公开(公告)号：US20250151230A1

公开(公告)日：2025-05-08

申请号：US19020494

申请日：2025-01-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Min LI ,  Fei YU ,  Lu BAI

IPC: H05K7/20

Abstract: This application provides example electronic assemblies. One example electronic assembly includes a first heat dissipation panel, a second heat dissipation panel, and a first circuit board assembly. The first heat dissipation panel is provided with a runner. The second heat dissipation panel is fastened to the first heat dissipation panel, and encloses a working medium cavity with the first heat dissipation panel, where the working medium cavity is in communication with the runner. The first circuit board assembly includes a first circuit board, a first component, and a second component, the first component and the second component are both disposed on a same side of the first circuit board, and the first circuit board and the first heat dissipation panel are disposed in a stacked manner.

公开(公告)号：US20250107023A1

公开(公告)日：2025-03-27

申请号：US18975395

申请日：2024-12-10

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaochen WANG ,  Min LI

IPC: H05K5/02

Abstract: Example support members and methods for manufacturing a support member are described. One example support member is configured to support a display. The display includes a first unbendable portion, a second unbendable portion, and a bendable portion. The support member includes a first support member opposite to the first unbendable portion, a second support member opposite to the second unbendable portion, and a bendable support member opposite to the bendable portion. The bendable support member is located between the first support member and the second support member. The bendable support member is provided with one or more through holes that penetrate through the bendable support member. An opening of each of the one or more through holes is located on a surface of the bendable support member opposite to the bendable portion.

公开(公告)号：US20250059409A1

公开(公告)日：2025-02-20

申请号：US18722876

申请日：2022-12-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fuguo XU ,  Weilin LI ,  Jie WANG ,  Min LI

IPC: C09J7/38 ,  C08K5/315 ,  C09J7/10 ,  C09J133/06

Abstract: This application provides an adhesive film and a preparation method thereof, a composite assembly, and an electronic device. The adhesive film is prepared through a cross-linking reaction of a prepolymer. The prepolymer includes an alkyl acrylate soft monomer and an acrylate polar monomer. A mass fraction of the alkyl acrylate soft monomer in the prepolymer is greater than or equal to 60 wt %. A mass fraction of the acrylate polar monomer in the prepolymer is less than 30 wt %. The adhesive film provided in this application has an excellent low modulus at a low temperature and a high creep recovery rate, and can be used to improve a service life of a foldable electronic device in repeated folding processes.

公开(公告)号：US20220311625A1

公开(公告)日：2022-09-29

申请号：US17841369

申请日：2022-06-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Kai PAN ,  Min LI ,  Jing CHEN

IPC: H04L9/32 ,  H04L9/08

Abstract: An example terminal device includes at least one processor and at least one memory coupled to the at least one processor and storing programming instructions for execution by the at least one processor to send a certificate application parameter to an interface adaptation function entity; and receive a certificate from the interface adaptation function entity, wherein the certificate is configured by a target certificate management function entity for the terminal device.

公开(公告)号：US20250048590A1

公开(公告)日：2025-02-06

申请号：US18926435

申请日：2024-10-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Min LI ,  Guangjing WANG ,  Lu BAI ,  Fei YU

IPC: H05K7/20

Abstract: This application provides a flexible liquid cooling heat dissipation unit. The flexible liquid cooling heat dissipation unit is configured to dissipate heat for a heat generation component. A liquid inlet and a liquid outlet are provided on the flexible liquid cooling heat dissipation unit. A heat exchange cavity that is used for accommodating a coolant and allowing the coolant to flow from the liquid inlet to the liquid outlet is provided in the flexible liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit includes a flexible sheet material. The flexible sheet material is obtained by compounding a plurality of functional film layers, the plurality of functional film layers include at least one anti-penetration layer, and permeability of the anti-penetration layer is less than 1 g/m2/24 hr.