公开(公告)号：US20170287875A1

公开(公告)日：2017-10-05

申请号：US15619532

申请日：2017-06-11

Applicant: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.

Inventor： Ziyang GAO ,  Xunqing SHI ,  Shi Wo CHOW

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L22/12 ,  H01L22/20 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/06548 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

公开(公告)号：US20170020027A1

公开(公告)日：2017-01-19

申请号：US14799594

申请日：2015-07-15

Applicant: Hong Kong Applied Science and Technology Research Institute Co. Ltd.

Inventor： Ziyang GAO ,  Ya LV ,  Yat Kit TSUI

IPC: H05K7/20

CPC classification number: H05K7/20218 ,  F28F3/022 ,  H01L23/3735 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20927

Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.

Abstract translation: 本发明公开了一种流体冷却组件，其有助于组件内的紊流，从而获得更好的散热效果。 冷却组件包括具有用于流体通过的入口和出口的封闭腔室; 加上散热器; 多个微柱和安装在组件内部的多个散热翅片。 当流体流过室时，这些元件组合适于在流体上产生增强的湍流，以便有效地从所述散热器散热通过流体。