公开(公告)号：US20170301513A1

公开(公告)日：2017-10-19

申请号：US15445055

申请日：2017-02-28

申请人： HITACHI HIGH-TECHNOLOGIES CORPORATION

发明人： Mayuka OSAKI ,  Chie SHISHIDO ,  Maki TANAKA ,  Hitoshi NAMAI ,  Fumihiro SASAJIMA ,  Makoto SUZUKI ,  Yoshinori MOMONOI

IPC分类号： H01J37/285 ,  H01J37/28 ,  H01J37/244

CPC分类号： H01J37/285 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/2814

摘要： A scanning electron microscope capable of properly determining a step of a step pattern formed on a sample regardless of combination of material of a groove of the step pattern and material of a projection of the step pattern, the scanning electron microscope includes a beam source, a detection unit having a first detection unit that detects a secondary electron emitted from the sample at an angle between an optical axis direction of the primary electron beam which is equal to or less than a predetermined value, and a second detection unit that detects a secondary electron emitted from the sample at an angle between the optical axis direction of the primary electron beam which is greater than the predetermined value, and a processing unit to obtain information on the step pattern using the information on a ratio between signals outputted from the first and the second detection unit.

公开(公告)号：US20160379798A1

公开(公告)日：2016-12-29

申请号：US15039527

申请日：2014-11-19

申请人： HITACHI HIGH-TECHNOLOGIES CORPORATION

发明人： Chie SHISHIDO ,  Takuma YAMAMOTO ,  Shinya YAMADA ,  Maki TANAKA

IPC分类号： H01J37/29 ,  H01J37/244 ,  G01B15/00

CPC分类号： H01J37/29 ,  G01B15/00 ,  G01B15/04 ,  G01B2210/56 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/24475 ,  H01J2237/2448 ,  H01J2237/24495 ,  H01J2237/2806 ,  H01J2237/281 ,  H01J2237/2815 ,  H01L22/12

摘要： In order to allow detecting backscattered electrons (BSEs) generated from the bottom of a hole for determining whether a hole with a super high aspect ratio is opened or for inspecting and measuring the ratio of the top diameter to the bottom diameter of a hole, which are typified in 3D-NAND processes of opening a hole, a primary electron beam accelerated at a high accelerating voltage is applied to a sample. Backscattered electrons (BSEs) at a low angle (e.g. a zenith angle of five degrees or more) are detected. Thus, the bottom of a hole is observed using “penetrating BSEs” having been emitted from the bottom of the hole and penetrated the side wall. Using the characteristics in which a penetrating distance is relatively prolonged through a deep hole and the amount of penetrating BSEs is decreased to cause a dark image, a calibration curve expressing the relationship between a hole depth and the brightness is given to measure the hole depth.

摘要翻译： 为了允许检测从孔的底部产生的背散射电子（BSE），用于确定是否打开具有超高纵横比的孔，或者用于检查和测量孔的顶部直径与底部直径的比， 以3D-NAND打开孔的方式为代表，以高加速电压加速的一次电子束被施加到样品。 检测到低角度（例如五度以上的天顶角）的背散射电子（BSE）。 因此，使用从孔的底部排出并穿透侧壁的“穿透BSE”来观察孔的底部。 利用穿透深度相对延长穿过深孔的特性，并减少穿透性BSE的量使黑暗的图像表现出孔深与亮度之间的关系的校准曲线来测量孔深度。

公开(公告)号：US20130322737A1

公开(公告)日：2013-12-05

申请号：US13905164

申请日：2013-05-30

申请人： Hitachi High-Technologies Corporation

发明人： Shinya MURAKAMI ,  Chie SHISHIDO ,  Takashi HIROI ,  Taku NINOMIYA ,  Tsuyoshi MINAKAWA ,  Atsushi MIYAMOTO

IPC分类号： G06T7/00

CPC分类号： G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

摘要： A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions, respectively from design data of the subject under inspection; finding a first misregistration amount between the inspection image and the design data using a first template as any one template selected from among the plural templates; finding a second misregistration amount between the inspection image and the design data using a second template other than the first template, the second template being selected from among the plural templates, and the first misregistration-amount; and converting the design data, misregistration thereof being corrected using the first misregistration-amount, and the second misregistration-amount, into a design data image, and comparing the design data image with the inspection image to thereby detect a defect of the subject under inspection.

摘要翻译： 一种缺陷检查方法，包括：拾取检查对象的图像，从而获取检查图像; 从被检查对象的设计数据分别提取与多个区域对应的多个模板; 使用第一模板在所述多个模板中选择任何一个模板，在所述检查图像和所述设计数据之间找到第一重合失调量; 使用除了第一模板之外的第二模板，从多个模板中选择第二模板和第一重合失调量，在检查图像和设计数据之间找到第二对准不足量; 并且将设计数据，其使用第一重合失调量和第二重合失调量进行校正的重新配准转换成设计数据图像，并将设计数据图像与检查图像进行比较，从而检测被检查对象的缺陷 。