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    AUTOMATIC SAMPLE PREPARATION APPARATUS
    1.
    发明申请
    AUTOMATIC SAMPLE PREPARATION APPARATUS 有权

    公开(公告)号：US20210341362A1

    公开(公告)日：2021-11-04

    申请号：US17373932

    申请日：2021-07-13

    申请人： Hitachi High-Tech Science Corporation

    发明人： Atsushi Uemoto ,  Tatsuya Asahata ,  Makoto Sato ,  Yo Yamamoto

    IPC分类号： G01N1/44 ,  H01J37/317 ,  H01J37/31 ,  G01N1/28

    摘要： An automatic sample preparation apparatus that automatically prepares a sample piece from a sample and includes a focused ion beam irradiation optical system, an electron beam irradiation optical system configured to irradiate an electron beam from a direction different from a direction of the focused ion beam, a sample piece transfer device configured to hold and transfer the sample piece separated and extracted from the sample, a detector configured to detect secondary charged particles emitted from an irradiation object, and a computer configured to recognize a position of the sample piece transfer device by image-recognition using an image data of the focused ion beam and the electron beam generated by irradiating the sample piece transfer device with the focused ion beam and the electron beam, and drive the sample piece transfer device, wherein the image data includes a reference mark.

    Cross section processing method and cross section processing apparatus
    4.
    发明授权
    Cross section processing method and cross section processing apparatus 有权
    截面加工方法及截面加工装置

    公开(公告)号：US09548185B2

    公开(公告)日：2017-01-17

    申请号：US14520595

    申请日：2014-10-22

    申请人： HITACHI HIGH-TECH SCIENCE CORPORATION

    发明人： Hidekazu Suzuki ,  Tatsuya Asahata ,  Atsushi Uemoto

    IPC分类号： H01J37/26 ,  H01J37/305 ,  G01N1/32 ,  H01J37/304

    CPC分类号： H01J37/3056 ,  G01N1/32 ,  H01J37/304 ,  H01J2237/31745

    摘要： A cross section processing method and a cross section processing apparatus are provided in which it is possible to form a flat cross section in a sample composed of a plurality of substances having different hardness by a focused ion beam. The etching of a processing area is performed while variably controlling the irradiation interval, the irradiation time, or the like of a focused ion beam based on cross section information of an SEM image obtained by the observation of a cross section. In this way, even if a sample is composed of a plurality of substances having different hardness, it is possible to form a flat observation surface with a uniform etching rate.

    摘要翻译： 提供一种横截面加工方法和横截面加工装置，其中可以在通过聚焦离子束由具有不同硬度的多种物质组成的样品中形成平坦的横截面。 基于通过观察截面获得的SEM图像的横截面信息，可以可变地控制聚焦离子束的照射间隔，照射时间等进行处理区域的蚀刻。 以这种方式，即使样品由具有不同硬度的多种物质组成，也可以形成具有均匀蚀刻速率的平坦观察面。

    Charged particle beam apparatus and sample processing method using charged particle beam apparatus
    5.
    发明授权
    Charged particle beam apparatus and sample processing method using charged particle beam apparatus 有权
    带电粒子束装置和采用带电粒子束装置的样品处理方法

    公开(公告)号：US09202671B2

    公开(公告)日：2015-12-01

    申请号：US14220981

    申请日：2014-03-20

    申请人： HITACHI HIGH-TECH SCIENCE CORPORATION

    发明人： Xin Man ,  Atsushi Uemoto ,  Tatsuya Asahata

    IPC分类号： H01J37/252 ,  H01J37/26 ,  H01J37/30

    CPC分类号： H01J37/3002 ,  H01J37/252 ,  H01J37/26 ,  H01J37/304 ,  H01J37/3056 ,  H01J2237/30455

    摘要： A charged particle beam apparatus includes a sample stage, a focused ion beam column, a scattered electron detector that detects backscattered electrons generated from a cross-section of a sample, a crystal orientation information generation unit that generates crystal orientation information on a predetermined region of the cross-section, and an angle calculation unit that calculates attachment angles of the sample stage, corresponding to a direction of the cross-section. In response to receiving input of information indicating that the crystal orientation information on the region displayed on a display unit is changed to aimed second crystal orientation information, the angle calculation unit calculates the attachment angles corresponding to the direction of the cross-section for generating the second crystal orientation information, and the focused ion beam column performs etching processing on the cross-section at the calculated attachment angles.

    摘要翻译： 带电粒子束装置包括：样品台，聚焦离子束柱，检测从样品的横截面产生的反向散射电子的散射电子检测器;晶体取向信息生成单元，其在预定区域上生成晶体取向信息; 横截面，以及角度计算单元，其计算与横截面方向对应的样品台的附着角度。 响应于接收到指示将显示在显示单元上的区域的晶体取向信息改变为目标第二晶体取向信息的信息的输入，角度计算单元计算与用于生成显示单元的横截面的方向相对应的附着角度 第二晶体取向信息，聚焦离子束列以计算出的安装角度对横截面进行蚀刻处理。

    Charged particle beam apparatus and control method thereof
    7.
    发明授权
    Charged particle beam apparatus and control method thereof 有权

    公开(公告)号：US11177113B2

    公开(公告)日：2021-11-16

    申请号：US16820852

    申请日：2020-03-17

    申请人： HITACHI HIGH-TECH SCIENCE CORPORATION

    发明人： Ayana Muraki ,  Tatsuya Asahata ,  Atsushi Uemoto

    IPC分类号： H01J37/304 ,  H01J37/22 ,  H01J37/28

    摘要： Automated processing is provided. A charged particle beam apparatus includes: an image identity degree determination unit determining whether an identity degree is equal to or greater than a predetermined value, the identity degree indicating a degree of identity between a processing cross-section image that is an SEM image obtained through observation of a cross section of the sample by a scanning electron microscope, and a criterion image that is the processing cross-section image previously registered; and a post-determination processing unit performing a predetermined processing operation according to a result of the determination by the image identity degree determination unit.

    Automatic sample preparation apparatus and automatic sample preparation method
    10.
    发明授权
    Automatic sample preparation apparatus and automatic sample preparation method 有权

    公开(公告)号：US11073453B2

    公开(公告)日：2021-07-27

    申请号：US16935575

    申请日：2020-07-22

    申请人： Hitachi High-Tech Science Corporation

    发明人： Atsushi Uemoto ,  Tatsuya Asahata ,  Makoto Sato ,  Yo Yamamoto

    IPC分类号： G01N1/44 ,  H01J37/31 ,  G01N1/28 ,  H01J37/317

    摘要： An automatic sample preparation apparatus that automatically prepares a sample piece from a sample includes: a focused ion beam irradiation optical system configured to irradiate a focused ion beam; an electron beam irradiation optical system configured to irradiate an electron beam from a direction different from a direction of the focused ion beam; a sample piece transfer device configured to hold and transfer the sample piece separated and extracted from the sample; a detector configured to detect secondary charged particles emitted from an irradiation object by irradiating the irradiation object with the focused ion beam and/or the electron beam; and a computer configured to recognize a position of the sample piece transfer device by image-recognition using an image data of the focused ion beam and the electron beam generated by irradiating the sample piece transfer device with the focused ion beam and the electron beam, and drive the transfer device.