Abstract:
The present invention generally relates to methods for forming a sensor structure utilizing a shallow and narrow hard mask stencil. In one embodiment, a sensor structure is formed by utilizing a four-layered hard mask stencil. The four-layered hard mask stencil includes a first mask layer, a second mask layer disposed over the first hard mask, a third mask layer disposed over the second mask layer, and a forth mask layer disposed over the third mask layer. In another embodiment, a sensor structure is formed by utilizing a three-layered hard mask stencil. The three-layered hard mask stencil includes a first mask layer, a second mask layer disposed over the first mask layer, and a third mask layer disposed over the second mask layer. The sensor structure is formed with a two-step chemical mechanical planarization (CMP) process.
Abstract:
The embodiments of the present invention relate to a method for forming a magnetic read head with pinned layers extending to the ABS of the read head and magnetically coupled with an antiferromagnetic layer that is recessed in relation to the ABS of the read head. Portions of the antiferromagnetic layer and a magnetic layer that are extending to the ABS are removed, exposing a shield. A shielding material is formed on the exposed shield and a seed layer is formed on the shield and on or over a portion of the remaining antiferromagnetic layer. A pinned layer structure is formed on the seed layer and the magnetic layer.