公开(公告)号：US20170372729A1

公开(公告)日：2017-12-28

申请号：US15190859

申请日：2016-06-23

Applicant: HGST Netherlands B.V.

Inventor： Damaris Davis ,  Glenn P. Gee ,  Darrick T. Smith ,  Hicham M. Sougrati

IPC: G11B5/31 ,  G11B5/60 ,  G11B5/127

CPC classification number: G11B5/3169 ,  G11B5/1278 ,  G11B5/3163 ,  G11B5/3173 ,  G11B5/6082

Abstract: A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

公开(公告)号：US09767833B1

公开(公告)日：2017-09-19

申请号：US15237345

申请日：2016-08-15

Applicant: HGST Netherlands B.V.

Inventor： Diane L. Brown ,  Glenn P. Gee ,  Darrick T. Smith ,  Hicham M. Sougrati

IPC: G11B5/265 ,  G11B5/105 ,  G11B5/31 ,  G11B5/008 ,  G11B5/127 ,  G11B5/10 ,  G11B5/48 ,  G11B21/16 ,  G11B5/29

CPC classification number: G11B5/3169 ,  G11B5/00813 ,  G11B5/102 ,  G11B5/105 ,  G11B5/1272 ,  G11B5/29 ,  G11B5/295 ,  G11B5/3166 ,  G11B5/3173 ,  G11B5/4853 ,  G11B21/16

Abstract: A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

公开(公告)号：US09881639B2

公开(公告)日：2018-01-30

申请号：US15190859

申请日：2016-06-23

Applicant: HGST Netherlands B.V.

Inventor： Damaris Davis ,  Glenn P. Gee ,  Darrick T. Smith ,  Hicham M. Sougrati

IPC: B24B41/06 ,  G11B5/31 ,  G11B5/60 ,  G11B5/127

CPC classification number: G11B5/3169 ,  G11B5/1278 ,  G11B5/3163 ,  G11B5/3173 ,  G11B5/6082

Abstract: A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

公开(公告)号：US20150154990A1

公开(公告)日：2015-06-04

申请号：US14094690

申请日：2013-12-02

Applicant: HGST Netherlands B.V.

Inventor： Hongquan Jiang ,  Quang Le ,  Thao Pham ,  David J. Seagle ,  Hicham M. Sougrati ,  Petrus A. Van Der Heijden

IPC: G11B5/39

CPC classification number: G11B5/3903 ,  G01R33/098 ,  G11B5/39 ,  G11B5/3906 ,  G11B5/3932 ,  G11B5/398 ,  G11B2005/3996 ,  Y10T428/1121

Abstract: A scissor type magnetic sensor having an improved back edge bias structure. The back edge bias structure extends beyond the sides of the sensor stack for improved bias moment and is formed on a flat topography that provide for improved magnetic biasing. The sensor is formed by a method that includes first defining a sensor width and then depositing a multi-layer insulation layer that includes a dielectric layer that is resistant to ion milling and the depositing a fill layer over the dielectric layer that is removable by ion milling. After the multi-layer insulation layer has been deposited the back edge (i.e. stripe height) of the sensor is formed by masking and ion milling. This ion milling removes portions of the non-magnetic, electrically insulating fill layer that extend beyond the stripe height and beyond the sides of the sensor, leaving the dielectric layer there-beneath.

Abstract translation: 具有改进的后缘偏置结构的剪刀式磁传感器。 后缘偏置结构延伸超过传感器堆叠的侧面以改善偏置力矩，并且形成在提供改进的磁偏置的平坦地形上。 传感器通过一种方法形成，该方法包括首先限定传感器宽度，然后沉积多层绝缘层，该多层绝缘层包括耐离子铣削的电介质层，并且在电介质层上沉积可通过离子铣削移除的填充层 。 在沉积多层绝缘层之后，通过掩模和离子铣削形成传感器的后边缘（即条纹高度）。 这种离子铣去除非磁性，电绝缘的填充层的部分，该部分延伸超过条带高度并超出传感器的侧面，在其下面留下介电层。

公开(公告)号：US09099122B2

公开(公告)日：2015-08-04

申请号：US14094690

申请日：2013-12-02

Applicant: HGST Netherlands B.V.

Inventor： Hongquan Jiang ,  Quang Le ,  Thao Pham ,  David J. Seagle ,  Hicham M. Sougrati ,  Petrus A. Van Der Heijden

IPC: G11B5/39

CPC classification number: G11B5/3903 ,  G01R33/098 ,  G11B5/39 ,  G11B5/3906 ,  G11B5/3932 ,  G11B5/398 ,  G11B2005/3996 ,  Y10T428/1121

Abstract: A scissor type magnetic sensor having an improved back edge bias structure. The back edge bias structure extends beyond the sides of the sensor stack for improved bias moment and is formed on a flat topography that provide for improved magnetic biasing. The sensor is formed by a method that includes first defining a sensor width and then depositing a multi-layer insulation layer that includes a dielectric layer that is resistant to ion milling and the depositing a fill layer over the dielectric layer that is removable by ion milling. After the multi-layer insulation layer has been deposited the back edge (i.e. stripe height) of the sensor is formed by masking and ion milling. This ion milling removes portions of the non-magnetic, electrically insulating fill layer that extend beyond the stripe height and beyond the sides of the sensor, leaving the dielectric layer there-beneath.

Abstract translation: 具有改进的后缘偏置结构的剪刀式磁传感器。 后缘偏置结构延伸超过传感器堆叠的侧面以改善偏置力矩，并且形成在提供改进的磁偏置的平坦地形上。 传感器通过一种方法形成，该方法包括首先限定传感器宽度，然后沉积多层绝缘层，该多层绝缘层包括耐离子铣削的电介质层，并且在电介质层上沉积可通过离子铣削移除的填充层 。 在沉积多层绝缘层之后，通过掩模和离子铣削形成传感器的后边缘（即条纹高度）。 这种离子铣去除非磁性，电绝缘的填充层的部分，该部分延伸超过条带高度并超出传感器的侧面，在其下面留下介电层。