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公开(公告)号：US20230324025A1
公开(公告)日：2023-10-12
申请号：US18210264
申请日：2023-06-15
IPC分类号： F21S41/657 , B60Q1/26 , H01R33/18 , H01R12/70 , H01R12/71
CPC分类号： F21S41/657 , B60Q1/2692 , H01R33/18 , H01R12/7023 , H01R12/714
摘要： An illumination device for a vehicle, having a housing in which a functional module and an actuating unit are arranged, wherein the actuating unit has a drive apparatus and a linear actuating element that is coupled to the functional module so that the functional module can be pivotably moved about a horizontal and/or vertical axis, wherein the drive apparatus is placed in contact with at least one circuit board integrated in the illumination device in a mounted position of the actuating unit so that both the drive apparatus of the actuating unit and the functional module are electrically connected by the same circuit board to an electrical system of the vehicle.
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公开(公告)号：US20210362646A1
公开(公告)日：2021-11-25
申请号：US17396004
申请日：2021-08-06
IPC分类号： B60Q1/26 , B60R11/04 , B60Q1/08 , B60Q1/04 , B60S1/56 , B60Q1/50 , B60R16/03 , B60R11/00 , B60R11/02
摘要： A structural unit for provision in the front end or in the tail end of a motor vehicle, wherein the structural unit comprises a support body and at least two environment sensing systems, wherein the environment sensing systems are received on the support body.
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公开(公告)号：US20240206047A1
公开(公告)日：2024-06-20
申请号：US18542599
申请日：2023-12-16
IPC分类号： H05K1/02 , F21S41/153 , H05K3/00 , H05K7/20
CPC分类号： H05K1/0204 , F21S41/153 , H05K3/002 , H05K7/20172 , F21Y2115/10 , H05K2201/10106
摘要： An electronic assembly having at least one electronic component, in particular a light-emitting diode, and a printed circuit board. The printed circuit board has a substrate, conductive traces, and at least one solder pad. The electronic component is held on the solder pad by a solder joint. The substrate has, on a back opposite the electronic component, a micro-cooling structure, wherein the micro-cooling structure is designed as an arrangement of recesses in the back of the substrate in such a manner that the micro-cooling structure is configured to dissipate heat from the electronic component.
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公开(公告)号：US20240240767A1
公开(公告)日：2024-07-18
申请号：US18413639
申请日：2024-01-16
CPC分类号： F21S41/192 , F21S41/25
摘要： A holding arrangement for lenses of a lighting device for vehicles with a number of lenses which are arranged axially spaced from one another and which are enclosed by a surrounding body formed of two half shells firmly connected to one another, wherein the surrounding body has a plastic material, wherein the surrounding body has such an axial length and holder that a light source unit of the lighting device is enclosed in an end region of the surrounding body to form a light module and that the plastic material is filled as a thermoplastic or thermosetting material or as a composite material with at least one thermal expansion-reducing additional material.
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公开(公告)号：US20200305271A1
公开(公告)日：2020-09-24
申请号：US16895784
申请日：2020-06-08
发明人： Dirk BOESCH , Frank BRINKMEIER , Markus GOESLING , Christian KOERDT , Werner KOESTERS , Frank MUENZNER , Sebastian NORDHOFF , Marc SCHLUETER , Thomas WIESE
摘要： The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.
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