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公开(公告)号:US11879731B2
公开(公告)日:2024-01-23
申请号:US17943474
申请日:2022-09-13
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomofumi Suzuki , Kyosuke Kotani , Tatsuya Sugimoto , Yutaka Kuramoto , Katsumi Shibayama , Noburo Hosokawa , Hirokazu Yamamoto , Takuo Koyama
IPC: G01B9/02 , B81B3/00 , G01J3/02 , G01J3/10 , G01J3/14 , G01J3/45 , G02B7/182 , G02B26/08 , G02B27/14 , G01J3/453
CPC classification number: G01B9/02051 , B81B3/00 , B81B3/007 , B81B3/0021 , G01B9/02049 , G01J3/021 , G01J3/0202 , G01J3/0237 , G01J3/108 , G01J3/14 , G01J3/45 , G02B7/182 , G02B26/0816 , G02B26/0833 , G02B26/0841 , G02B27/144 , B81B2201/042 , B81B2203/0154 , G01B2290/25 , G01B2290/35 , G01J3/4532 , G01J3/4535 , G01J2003/104
Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
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公开(公告)号:US11629946B2
公开(公告)日:2023-04-18
申请号:US16625684
申请日:2018-07-06
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomofumi Suzuki , Kyosuke Kotani , Tatsuya Sugimoto , Yutaka Kuramoto , Katsumi Shibayama , Noburo Hosokawa , Hirokazu Yamamoto , Takuo Koyama
IPC: G02B9/02 , G01B9/02 , B81B3/00 , G01J3/02 , G01J3/10 , G01J3/14 , G01J3/45 , G02B7/182 , G02B26/08 , G02B27/14 , G01J3/453
Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
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公开(公告)号:US11624605B2
公开(公告)日:2023-04-11
申请号:US16625696
申请日:2018-07-06
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomofumi Suzuki , Kyosuke Kotani , Tatsuya Sugimoto , Yutaka Kuramoto , Katsumi Shibayama , Noburo Hosokawa , Hirokazu Yamamoto , Takuo Koyama
IPC: G01B9/02 , B81B3/00 , G01J3/02 , G01J3/10 , G01J3/14 , G01J3/45 , G02B7/182 , G02B26/08 , G02B27/14 , G01J3/453
Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a part of an optical path between the beam splitter unit 3 and the fixed mirror 16. The light transmitting portion 14 is a portion that corrects an optical path difference that occurs between an optical path between the beam splitter unit 3 and the movable mirror 22 and the optical path between the beam splitter unit 3 and the fixed mirror 16. The second surface 21b of the base 21 and the third surface 13a of the optical function member 13 are joined to each other.
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公开(公告)号:US12152878B2
公开(公告)日:2024-11-26
申请号:US18535364
申请日:2023-12-11
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomofumi Suzuki , Kyosuke Kotani , Tatsuya Sugimoto , Yutaka Kuramoto , Katsumi Shibayama , Noburo Hosokawa , Hirokazu Yamamoto , Takuo Koyama
IPC: G01B9/02 , B81B3/00 , G01J3/02 , G01J3/10 , G01J3/14 , G01J3/45 , G02B7/182 , G02B26/08 , G02B27/14 , G01J3/453
Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
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公开(公告)号:US20230003504A1
公开(公告)日:2023-01-05
申请号:US17943474
申请日:2022-09-13
Applicant: Hamamatsu Photonics K.K.
Inventor: Tomofumi Suzuki , Kyosuke Kotani , Tatsuya Sugimoto , Yutaka Kuramoto , Katsumi Shibayama , Noburo Hosokawa , Hirokazu Yamamoto , Takuo Koyama
IPC: G01B9/02 , G02B26/08 , G02B7/182 , G01J3/02 , B81B3/00 , G01J3/10 , G01J3/14 , G02B27/14 , G01J3/45 , G01J3/453
Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
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公开(公告)号:US11482555B2
公开(公告)日:2022-10-25
申请号:US16963291
申请日:2018-11-27
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro Takagi , Yasuhito Yoneta , Masaharu Muramatsu , Nao Inoue , Hirokazu Yamamoto , Shinichi Nakata , Takuo Koyama
IPC: H01L31/00 , H01L27/146 , H01L21/56 , H01L23/31 , H01L23/00
Abstract: A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.
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