公开(公告)号：US20190265179A1

公开(公告)日：2019-08-29

申请号：US16406478

申请日：2019-05-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomonori NAKAMURA ,  Nobuyuki HIRAI

IPC: G01N25/72 ,  G01R31/311 ,  G01R31/02 ,  G01R31/265

Abstract: A heat source position inside a measurement object is identified with high accuracy by improving time resolution.An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

公开(公告)号：US20170299534A1

公开(公告)日：2017-10-19

申请号：US15516151

申请日：2014-10-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomonori NAKAMURA ,  Nobuyuki HIRAI

IPC: G01N25/72 ,  G01R31/265 ,  G01R31/02

CPC classification number: G01N25/72 ,  G01R31/025 ,  G01R31/2656 ,  G01R31/311

Abstract: A heat source position inside a measurement object is identified with high accuracy by improving time resolution.An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

公开(公告)号：US20150153408A1

公开(公告)日：2015-06-04

申请号：US14552926

申请日：2014-11-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Akihiro OTAKA ,  Mitsunori NISHIZAWA ,  Nobuyuki HIRAI ,  Tomonori NAKAMURA

IPC: G01R31/311

CPC classification number: G01R31/311

Abstract: A semiconductor device measurement apparatus 1A includes a tester 2 that generates an operational pulse signal to be input to a semiconductor device 3, a light source 5 that generates light, a light branch optical system 6 that irradiates the semiconductor device with the light, a light detector 7 that detects reflected light obtained by the semiconductor device 3 reflecting the light, and outputs a detection signal, an analog signal amplifier 8 that amplifies the detection signal and outputs an amplified signal, and an analysis apparatus 10 that analyzes an operation of the semiconductor device 3 based on the amplified signal and a predetermined correction value, wherein the predetermined correction value is obtained based on a signal obtained by the analog signal amplifier 8 amplifying a signal corresponding to a harmonic of a fundamental frequency of the operational pulse signal.

Abstract translation: 半导体器件测量装置1A包括产生要输入到半导体器件3的操作脉冲信号的测试器2，产生光的光源5，用光照射半导体器件的光分支光学系统6，光 检测器7，其检测由反射光的半导体器件3获得的反射光，并输出检测信号;放大检测信号并输出​​放大信号的模拟信号放大器8;以及分析半导体的运算的分析装置10 基于放大信号和预定校正值的装置3，其中基于由模拟信号放大器8获得的信号来获得预定校正值，该信号放大对应于操作脉冲信号的基频的谐波的信号。