公开(公告)号：US20190232422A1

公开(公告)日：2019-08-01

申请号：US16380660

申请日：2019-04-10

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kazuhiro ATSUMI ,  Koji KUNO ,  Masayoshi KUSUNOKI ,  Tatsuya SUZUKI ,  Kenshi FUKUMITSU ,  Fumitsugu FUKUYO

IPC: B23K26/04 ,  B28D5/00 ,  H01L21/67 ,  B23K26/53 ,  B23K26/40 ,  B23K26/38 ,  B23K26/06 ,  B23K26/046 ,  H01L21/78

CPC classification number: B23K26/048 ,  B23K26/046 ,  B23K26/0648 ,  B23K26/38 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B28D5/0011 ,  H01L21/67092 ,  H01L21/78

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the ltd object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

公开(公告)号：US20160368085A1

公开(公告)日：2016-12-22

申请号：US15255926

申请日：2016-09-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kazuhiro ATSUMI ,  Koji KUNO ,  Masayoshi KUSUNOKI ,  Tatsuya SUZUKI ,  Kenshi FUKUMITSU ,  Fumitsugu FUKUYO

IPC: B23K26/04 ,  B23K26/046 ,  H01L21/67 ,  B23K26/53 ,  B28D5/00 ,  H01L21/78 ,  B23K26/06 ,  B23K26/00

CPC classification number: B23K26/048 ,  B23K26/046 ,  B23K26/0648 ,  B23K26/38 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B28D5/0011 ,  H01L21/67092 ,  H01L21/78

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and 512) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

Abstract translation: 该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和512），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域 一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体 主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

公开(公告)号：US20160329246A1

公开(公告)日：2016-11-10

申请号：US15213723

申请日：2016-07-19

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Makoto NAKANO ,  Koji KUNO ,  Tetsuya OSAJIMA ,  Takashi INOUE ,  Masayoshi KUMAGAI

IPC: H01L21/78 ,  C03B33/02 ,  B23K26/53 ,  B23K26/064 ,  H01L23/544 ,  B23K26/00

CPC classification number: H01L21/78 ,  B23K26/0006 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0861 ,  B23K26/128 ,  B23K26/40 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/50 ,  B23K2103/56 ,  B28D1/221 ,  B28D5/00 ,  C03B33/0222 ,  H01L23/544 ,  H01L2223/54453 ,  Y10T29/49826

Abstract: An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

Abstract translation: 用由反射型空间光调制器调制的激光照射物体，使得会聚在物体内的激光的像差成为预定像差或更小。 因此，在激光的会聚点所在的位置处产生的激光的像差尽可能地小，以增强该位置处的激光的能量密度，这使得可以形成经修改的 具有高功能的区域作为切割的起点。 此外，由于使用反射型空间光调制器，与透射型空间光调制器相比，可以提高激光的利用效率。

公开(公告)号：US20140097163A1

公开(公告)日：2014-04-10

申请号：US14099236

申请日：2013-12-06

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kazuhiro ATSUMI ,  Koji KUNO ,  Masayoshi KUSUNOKI ,  Tatsuya SUZUKI ,  Kenshi FUKUMITSU ,  Fumitsugu FUKUYO

IPC: B23K26/06 ,  B23K26/38

CPC classification number: B23K26/048 ,  B23K26/046 ,  B23K26/0648 ,  B23K26/38 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B28D5/0011 ,  H01L21/67092 ,  H01L21/78

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

Abstract translation: 提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。 该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域 一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体 主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

公开(公告)号：US20240416462A1

公开(公告)日：2024-12-19

申请号：US18695444

申请日：2022-09-28

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Koji KUNO

IPC: B23K26/70 ,  H01S5/02251

Abstract: A laser processing apparatus includes: a laser light source that oscillates a laser light; a transmission optical fiber that transmits the oscillated laser light from the laser light source; a laser irradiation unit that irradiates an object with the laser light transmitted by the transmission optical fiber; a power supply that receives an input of an AC voltage to generate a drive voltage for enabling the laser light source to oscillate the laser, and to apply the drive voltage to the laser light source; a semiconductor switch provided on a path of the drive voltage between the power supply and the laser light source; a mechanical relay provided on a path of the AC voltage to the power supply.

公开(公告)号：US20230054570A1

公开(公告)日：2023-02-23

申请号：US17794066

申请日：2021-01-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Koji KUNO

IPC: B23K26/53 ,  B23K26/08 ,  B23K26/06 ,  B23K26/03

Abstract: The controller executes a first process of moving a support portion so that inside the peripheral edge of an object, a focusing position moves along the peripheral edge, thereby forming a first modified region, and following the first process, executes a second process of moving the support portion so that the focusing position moves, thereby forming a second modified region The measurement data acquiring portion, at execution of the first process, acquires measurement data associated with position information on a position of the object. The controller, at execution of the second process, causes the driving portion to shift a position of the condenser lens, the position being along the direction of an optical axis, to an initial position based on the measurement data acquired in the first process, before or when the focusing position moves from outside of the object to inside thereof.