公开(公告)号：US20210373071A1

公开(公告)日：2021-12-02

申请号：US16766095

申请日：2018-09-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Akira SHIMASE ,  Kazuhiro HOTTA

IPC: G01R31/28 ,  G01R31/265 ,  G01R31/308 ,  G01R31/26 ,  G01R1/07

Abstract: An inspection apparatus includes a light sensor that detects light from a semiconductor device to which an electric signal has been input, an optical system that guides light from the semiconductor device to the light sensor, and a control device electrically connected to the light sensor. The control device includes a measurement unit that acquires waveform data obtained by optical measurement for each of a plurality of positions on a defective semiconductor device and waveform data obtained by the optical measurement for each of a plurality of positions on a non-defective semiconductor device, a calculation unit that calculates a degree of correspondence between the waveform data of the defective semiconductor device and the waveform data of the non-defective semiconductor device, and an analysis unit that analyzes a defective part of the defective semiconductor device on the basis of the degree of correspondence for each of the plurality of positions.

公开(公告)号：US20150187059A1

公开(公告)日：2015-07-02

申请号：US14582520

申请日：2014-12-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kazuhiro HOTTA

IPC: G06T7/00 ,  G06K9/62 ,  G06K9/52

CPC classification number: G06T7/001 ,  G06K9/48 ,  G06K9/52 ,  G06K9/6201 ,  G06T2207/10048 ,  G06T2207/30148

Abstract: An image processing method includes a step of acquiring a measured image G1B measured from a semiconductor device S and a first pattern image G2B showing a pattern of the semiconductor device S, a step of acquiring a reference measured image G3B measured from a reference semiconductor device SR being the semiconductor device S or a semiconductor device different from the semiconductor device S and a second pattern image G4B showing a pattern of the reference semiconductor device SR, a step of acquiring matching information indicating a correlation of the first pattern image G2B and the second pattern image G4B, and a step of determining a difference of the measured image G1B and the reference measured image G3B based on the matching information to acquire a comparative image G5B.

Abstract translation: 一种图像处理方法包括获取从半导体器件S测量的测量图像G1B和示出半导体器件S的图案的第一图案图像G2B的步骤，获取从参考半导体器件SR测量的参考测量图像G3B的步骤 作为与半导体器件S不同的半导体器件S或半导体器件以及示出参考半导体器件SR的图案的第二图案图像G4B，获取表示第一图案图像G2B和第二图案的相关性的匹配信息的步骤 图像G4B，以及基于匹配信息确定测量图像G1B和参考测量图像G3B的差异以获取比较图像G5B的步骤。

公开(公告)号：US20220301135A1

公开(公告)日：2022-09-22

申请号：US17608857

申请日：2020-04-16

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

IPC: G06T7/00 ,  G06T3/40 ,  G06T7/30

Abstract: A semiconductor inspection method by an observation system includes a step of acquiring a first pattern image showing a pattern of a semiconductor device, a step of acquiring a second pattern image showing a pattern of the semiconductor device and having a different resolution from a resolution of the first pattern image, a step of learning a reconstruction process of the second pattern image using the first pattern image as training data by machine learning, and reconstructing the second pattern image into a reconstructed image having a different resolution from a resolution of the second pattern image by the reconstruction process based on a result of the learning, and a step of performing alignment based on a region calculated to have a high degree of certainty by the reconstruction process in the reconstructed image and the first pattern image.

公开(公告)号：US20200333134A1

公开(公告)日：2020-10-22

申请号：US16766069

申请日：2018-09-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Akira SHIMASE ,  Kazuhiro HOTTA

IPC: G01B11/24 ,  G01N21/956

Abstract: A semiconductor device inspection apparatus includes: a light sensor that detects light from a semiconductor device as a DUT to which an electric signal has been input; an optical system that guides light from the semiconductor device to the light sensor; and a control device electrically connected to the light sensor. The control device includes: a data reading unit that reads mask data indicating a mask layout of the semiconductor device; a search unit that searches for a position of a transistor in the semiconductor device on the basis of polygon data of a gate layer of the semiconductor device included in the mask data; a setting unit that sets the searched position of the transistor as an optical measurement target position; and a measurement unit that performs optical measurement for the set optical measurement target position to acquire a measurement result.

公开(公告)号：US20220206063A1

公开(公告)日：2022-06-30

申请号：US17606829

申请日：2020-04-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

IPC: G01R31/303

Abstract: A semiconductor device examination method includes a step of acquiring a first interference waveform based on signals from a plurality of drive elements according to light from a first light beam spot including the plurality of drive elements in a semiconductor device, a step of acquiring a second interference waveform based on signals from the plurality of drive elements according to light from a second light beam spot having a region configured to partially overlap the first spot and including the plurality of drive elements, and a step of separating a waveform signal for each of the drive elements in the first and second spots based on the first and second interference waveforms.

公开(公告)号：US20150187058A1

公开(公告)日：2015-07-02

申请号：US14582507

申请日：2014-12-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kazuhiro HOTTA

IPC: G06T7/00 ,  G06K9/62 ,  G06K9/48

CPC classification number: G06T7/001 ,  G06K9/48 ,  G06K9/52 ,  G06K9/6201 ,  G06T2207/10048 ,  G06T2207/30148

Abstract: An image processing method in an observation system 1A includes a step of acquiring a measured image G1 measured from a semiconductor device S and a first pattern image G2 showing a pattern of the semiconductor device S corresponding to the measured image G1, a step of acquiring a second pattern image G3 showing a pattern of the semiconductor device S, a step of acquiring matching information indicating a correlation of the first pattern image G2 and the second pattern image G3 based on the first pattern image G2 and the second pattern image G3, and a step of superimposing the second pattern image G3 and the measured image G1 based on the matching information to acquire a superimposed image G4.

Abstract translation: 观察系统1A中的图像处理方法包括获取从半导体器件S测量的测量图像G1和示出与测量图像G1相对应的半导体器件S的图案的第一图案图像G2的步骤，获取 示出半导体装置S的图案的第二图案图像G3，基于第一图案图像G2和第二图案图像G3获取表示第一图案图像G2和第二图案图像G3的相关性的匹配信息的步骤，以及 基于匹配信息叠加第二图案图像G3和测量图像G1以获取叠加图像G4的步骤。

公开(公告)号：US20220301197A1

公开(公告)日：2022-09-22

申请号：US17608833

申请日：2020-04-16

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

IPC: G06T7/30 ,  G06T11/00

Abstract: An observation system includes a detector that detects light from a semiconductor device and outputs a detection signal, a 2D camera, an optical device that guides light to the detector and the 2D camera, an image processing unit that generates a first optical image of the semiconductor device based on the detection signal and receives an input of a first CAD image, an image analysis unit that learns a conversion process of the first CAD image by machine learning using the first optical image as training data, and converts the first CAD image into a second CAD image resembling the first optical image by the conversion process based on a result of the learning, and an alignment unit that performs alignment based on a second optical image and the second CAD image.

公开(公告)号：US20220221411A1

公开(公告)日：2022-07-14

申请号：US17604000

申请日：2020-04-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

IPC: G01N21/95 ,  G01N21/88

Abstract: A semiconductor apparatus examination method includes a step of acquiring a first interference waveform based on signals from a plurality of drive elements according to light from a first light beam spot including the plurality of drive elements in a semiconductor apparatus, a step of acquiring a second interference waveform based on signals from the plurality of drive elements according to light from a second light beam spot having a region configured to partially overlap the first spot and including the plurality of drive elements, and a step of separating a waveform signal for each of the drive elements in the first and second spots based on the first and second interference waveforms.