公开(公告)号：US12187607B2

公开(公告)日：2025-01-07

申请号：US17288642

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nao Inoue ,  Jo Ito ,  Go Tanaka ,  Atsuya Iima ,  Daiki Suzuki ,  Katsumi Shibayama

IPC: B81C1/00 ,  B81B7/00

Abstract: A method of manufacturing a semiconductor substrate according to an embodiment includes a first step of forming a groove having a bottom surface and a side surface on which scallops are formed by performing a process including isotropic etching on a main surface of a substrate, a second step of performing at least one of a hydrophilic treatment on the side surface of the groove and a degassing treatment on the groove, and a third step of removing the scallops formed on the side surface of the groove and planarizing the side surface by performing anisotropic wet etching in a state where the bottom surface of the recess is present.

公开(公告)号：US11675185B2

公开(公告)日：2023-06-13

申请号：US17512045

申请日：2021-10-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki Suzuki ,  Yuki Morinaga ,  Go Tanaka

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10

CPC classification number: G02B26/085 ,  B81B3/0075 ,  G02B26/10 ,  B81B2201/042

Abstract: An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.

公开(公告)号：US12085710B2

公开(公告)日：2024-09-10

申请号：US18138266

申请日：2023-04-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki Suzuki ,  Yuki Morinaga ,  Go Tanaka

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10

CPC classification number: G02B26/085 ,  B81B3/0075 ,  G02B26/10 ,  B81B2201/042

Abstract: An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.

公开(公告)号：US11519785B2

公开(公告)日：2022-12-06

申请号：US16636539

申请日：2018-07-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Masahiro Yamazaki ,  Katsumi Shibayama ,  Ryusuke Kitaura ,  Ryosuke Koike ,  Go Tanaka

IPC: G01J5/20 ,  G01J1/02 ,  G01J5/02 ,  G01J5/04 ,  H01L27/144 ,  H01L31/0232 ,  H01L31/0248 ,  H01L31/09

Abstract: A light detector includes a substrate, a membrane disposed on a surface of the substrate, a first and a second electrode post supporting the membrane. The first electrode post includes a first main body portion having a tubular shape spreading from a first electrode pad toward a side opposite to the substrate, and a first flange portion provided in an end portion at the side opposite to the substrate in the first main body portion. The first flange portion is provided with a first sloped surface inclined so as to approach the substrate as it goes away from the first main body portion. A first wiring layer reaches an inner surface of the first main body portion through the first sloped surface. The second electrode post and the second wiring layer are formed similarly to the first electrode post and the first wiring layer.

公开(公告)号：US11199695B2

公开(公告)日：2021-12-14

申请号：US16631259

申请日：2018-06-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki Suzuki ,  Yuki Morinaga ,  Go Tanaka

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10

Abstract: An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.