公开(公告)号：US09305969B2

公开(公告)日：2016-04-05

申请号：US13666098

申请日：2012-11-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Motohiro Suyama ,  Akiomi Ujima ,  Kentaro Maeta ,  Hisanori Suzuki ,  Masaharu Muramatsu ,  Fumio Iwase

IPC: G06M7/00 ,  H01L27/00 ,  H01L27/148 ,  H04N5/3722 ,  H04N3/14

CPC classification number: H01L27/14843 ,  H04N3/1525 ,  H04N3/1537 ,  H04N5/3722

Abstract: A solid-state imaging device 1A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns, N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the imaging plane 12, and N signal readout circuits 30 arranged on the other end side in the column direction for each of the columns with respect to the imaging plane 12, a semiconductor element 50 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 20 for each of the columns, and a semiconductor element 60 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 30 for each of the columns.

Abstract translation: 固态成像装置1A包括CCD型固体摄像元件10，其具有由M×N个像素形成的成像面12，二维排列成M行N列，N个信号读出电路20配置在一个 相对于成像面12的各列的列方向的端侧，以及相对于摄像面12对于列的列方向配置在另一端侧的N个信号读出电路30，半导体 元件50，用于数字转换，然后顺序地输出作为串行信号从每个列的信号读出电路20输出的电信号;以及半导体元件60，用于数字转换，然后顺序地输出作为串行信号从信号输出的电信号 每列的读出电路30。

公开(公告)号：US20150063548A1

公开(公告)日：2015-03-05

申请号：US14380988

申请日：2013-02-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Norimasa Kosugi ,  Naoki Okumura ,  Tatsuya Nakamura ,  Toru Fujita ,  Tomoyuki Okada ,  Akiomi Ujima

IPC: H01J35/02 ,  H01J35/18

CPC classification number: H01J35/025 ,  H01J35/045 ,  H01J35/18 ,  H01J2235/02 ,  H01J2235/186 ,  H05G1/06 ,  H05G1/70

Abstract: In an X-ray radiation source, a lid part is fastened to a main part with screws, so that an X-ray tube is secured to a housing while being pressed against an inner surface of the wall part a by a first circuit board. The X-ray tube can be secured stably within the housing by thus being held between the first circuit board and the wall part. The X-ray radiation source uses the first circuit board incorporated in the housing itself for pressing the X-ray tube. This makes it unnecessary to provide new members for pressing the X-ray tube and can prevent the device structure from becoming complicated.

Abstract translation: 在X射线辐射源中，用螺钉将盖部分固定在主体部分上，使得X射线管通过第一电路板按压到壁部a的内表面而固定在壳体上。 因此，通过将X射线管保持在第一电路基板与壁部之间，能够稳定地固定在壳体内。 X射线辐射源使用结合在壳体本身中的第一电路板来挤压X射线管。 这不需要提供用于按压X射线管的新构件，并且可以防止装置结构变得复杂。

公开(公告)号：US09349563B2

公开(公告)日：2016-05-24

申请号：US14380988

申请日：2013-02-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Norimasa Kosugi ,  Naoki Okumura ,  Tatsuya Nakamura ,  Toru Fujita ,  Tomoyuki Okada ,  Akiomi Ujima

IPC: H01J5/18 ,  H01J35/02 ,  H05G1/70 ,  H01J35/18 ,  H01J35/04 ,  H05G1/06

CPC classification number: H01J35/025 ,  H01J35/045 ,  H01J35/18 ,  H01J2235/02 ,  H01J2235/186 ,  H05G1/06 ,  H05G1/70

Abstract: In an X-ray radiation source, a lid part is fastened to a main part with screws, so that an X-ray tube is secured to a housing while being pressed against an inner surface of the wall part a by a first circuit board. The X-ray tube can be secured stably within the housing by thus being held between the first circuit board and the wall part. The X-ray radiation source uses the first circuit board incorporated in the housing itself for pressing the X-ray tube. This makes it unnecessary to provide new members for pressing the X-ray tube and can prevent the device structure from becoming complicated.

Abstract translation: 在X射线辐射源中，用螺钉将盖部分固定在主体部分上，使得X射线管通过第一电路板按压到壁部a的内表面而固定在壳体上。 因此，通过将X射线管保持在第一电路基板与壁部之间，能够稳定地固定在壳体内。 X射线辐射源使用结合在壳体本身中的第一电路板来挤压X射线管。 这不需要提供用于按压X射线管的新构件，并且可以防止装置结构变得复杂。

公开(公告)号：US20150030131A1

公开(公告)日：2015-01-29

申请号：US14378723

申请日：2013-02-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Norimasa Kosugi ,  Naoki Okumura ,  Tatsuya Nakamura ,  Toru Fujita ,  Tomoyuki Okada ,  Akiomi Ujima

IPC: H05G1/70 ,  H05G1/10 ,  H05G1/54 ,  H05G1/08 ,  H05G1/02

CPC classification number: H05G1/70 ,  H05G1/02 ,  H05G1/085 ,  H05G1/10 ,  H05G1/54

Abstract: An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the X-ray tube, and a trunk line connected to the drive circuit, and a controller having a control circuit for controlling the X-ray radiation units. The trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit so that the drive circuits of the plurality of X-ray radiation units are connected in parallel to the control circuit. Since the trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit, the X-ray radiation units can be connected to each other and are not required to be connected one by one to the controller. This makes it possible to increase and decrease the number of units without complicating their wiring.

Abstract translation: X射线辐射装置包括多个X射线辐射单元，每个X射线辐射单元具有用于产生X射线的X射线管，用于驱动X射线管的驱动电路和连接到驱动电路的干线 以及具有用于控制X射线辐射单元的控制电路的控制器。 多个X射线单元的干线与控制电路串联连接，使得多个X射线单元的驱动电路与控制电路并联连接。 由于多个X射线辐射单元的干线与控制电路串联连接，所以可以将X射线辐射单元相互连接，不需要一个接一个连接到控制器。 这使得可以增加和减少单元数量而不会使其布线复杂化。

公开(公告)号：US09445487B2

公开(公告)日：2016-09-13

申请号：US14378723

申请日：2013-02-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Norimasa Kosugi ,  Naoki Okumura ,  Tatsuya Nakamura ,  Toru Fujita ,  Tomoyuki Okada ,  Akiomi Ujima

IPC: H05G1/02 ,  H05G1/70 ,  H05G1/08 ,  H05G1/10 ,  H05G1/54

CPC classification number: H05G1/70 ,  H05G1/02 ,  H05G1/085 ,  H05G1/10 ,  H05G1/54

Abstract: An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the X-ray tube, and a trunk line connected to the drive circuit, and a controller having a control circuit for controlling the X-ray radiation units. The trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit so that the drive circuits of the plurality of X-ray radiation units are connected in parallel to the control circuit. Since the trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit, the X-ray radiation units can be connected to each other and are not required to be connected one by one to the controller. This makes it possible to increase and decrease the number of units without complicating their wiring.

Abstract translation: X射线辐射装置包括多个X射线辐射单元，每个X射线辐射单元具有用于产生X射线的X射线管，用于驱动X射线管的驱动电路和连接到驱动电路的干线 以及具有用于控制X射线辐射单元的控制电路的控制器。 多个X射线单元的干线与控制电路串联连接，使得多个X射线单元的驱动电路与控制电路并联连接。 由于多个X射线辐射单元的干线与控制电路串联连接，所以可以将X射线辐射单元相互连接，不需要一个接一个连接到控制器。 这使得可以增加和减少单元数量而不会使其布线复杂化。

公开(公告)号：US09054000B2

公开(公告)日：2015-06-09

申请号：US13666149

申请日：2012-11-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Motohiro Suyama ,  Akiomi Ujima ,  Kentaro Maeta ,  Hisanori Suzuki ,  Masaharu Muramatsu ,  Fumio Iwase

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L2224/16 ,  H01L2224/48091 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A solid-state imaging device 2A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns and N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the plane 12 and for outputting electrical signals according to the magnitudes of charges taken out of the respective columns, respectively, a C-MOS-type semiconductor element 50 for digital-converting and sequentially outputting as serial signals electrical signals output from the circuits 20 for each of the columns, a heat transfer member 80 having a main surface 81a and a back surface 81b, and a cooling block 84 provided on the surface 81b, and the semiconductor element 50 and the surface 81a of the heat transfer member 80 are bonded to each other.

Abstract translation: 固态成像装置2A包括CCD型固体摄像元件10，该CCD型固体摄像元件10具有由M×N像素构成的摄像面12，二维排列成M行N列，N信号读出电路20配置在一方 用于每个列相对于平面12的列方向的端侧，并分别根据从各列取出的电荷的大小输出电信号，用于数字转换的C-MOS型半导体元件 并顺序地输出作为串行信号从每个列的电路20输出的电信号，具有主表面81a和后表面81b的传热构件80和设置在表面81b上的冷却块84，以及半导体元件 50和传热构件80的表面81a彼此接合。