公开(公告)号：US20140146466A1

公开(公告)日：2014-05-29

申请号：US14171510

申请日：2014-02-03

Applicant: Google Inc.

Inventor： Michael Chi Kin Lau ,  Richard C. Bruns ,  Melanie Beauchemin

IPC: H05K7/20

CPC classification number: H05K7/20718 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20163 ,  H05K7/20336 ,  H05K7/20445 ,  H05K7/20727 ,  H05K7/20809 ,  H01L2924/00

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract translation: 服务器机架子组件包括至少一个具有周边的主板; 多个发热电子装置，安装在母板的与主板周边热分离的区域中; 一个或多个支架，包括传热表面，并沿着主板周边的至少一部分连接到母板; 以及传热装置，其热耦合到所述母板的与所述母板周边和所述一个或多个支架热分离的区域。 一个或多个支架适于接收在支架上循环的冷却气流并将热量对流地传递到冷却气流中，并且还适于将母板耦合到服务器机架组件。 传热装置被布置成将热量从一个或多个电子装置传导到托架。

公开(公告)号：US09313926B2

公开(公告)日：2016-04-12

申请号：US14171510

申请日：2014-02-03

Applicant: Google Inc.

Inventor： Michael Chi Kin Lau ,  Richard C. Bruns ,  Melanie Beauchemin

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/467

CPC classification number: H05K7/20718 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20163 ,  H05K7/20336 ,  H05K7/20445 ,  H05K7/20727 ,  H05K7/20809 ,  H01L2924/00

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract translation: 服务器机架子组件包括至少一个具有周边的主板; 多个发热电子装置，安装在母板的与主板周边热分离的区域中; 一个或多个支架，包括传热表面，并沿着主板周边的至少一部分连接到母板; 以及传热装置，其热耦合到所述母板的与所述母板周边和所述一个或多个支架热分离的区域。 一个或多个支架适于接收在支架上循环的冷却气流并将热量对流地传递到冷却气流中，并且还适于将母板耦合到服务器机架组件。 传热装置被布置成将热量从一个或多个电子装置传导到托架。