公开(公告)号：US08890306B2

公开(公告)日：2014-11-18

申请号：US13808300

申请日：2011-05-24

申请人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

发明人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

IPC分类号： H01L23/15 ,  H01L23/08 ,  H01L33/64 ,  H01L25/075 ,  H05K1/02 ,  H01L23/10 ,  H05K1/05 ,  H01L33/62

CPC分类号： H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.

摘要翻译： 发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括 所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面 二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

公开(公告)号：US08772065B2

公开(公告)日：2014-07-08

申请号：US13611890

申请日：2012-09-12

申请人： Georg Bogner ,  Karlheinz Arndt

发明人： Georg Bogner ,  Karlheinz Arndt

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L23/49805 ,  H01L24/48 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

摘要翻译： 具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面， 并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向 与安装表面（19）的关系。 此外，提供了一种用于生产包装体（1）的方法。

公开(公告)号：US08283684B2

公开(公告)日：2012-10-09

申请号：US12443155

申请日：2007-09-19

申请人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

发明人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

IPC分类号： H01L33/00

CPC分类号： H01L27/15 ,  H01L24/24 ,  H01L25/0756 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/32145 ,  H01L2924/0002 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.

摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。 每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小 跨越LED半导体体。 本发明还描述了LED半导体本体的各种用途。

公开(公告)号：US08189123B2

公开(公告)日：2012-05-29

申请号：US11914020

申请日：2006-04-21

申请人： Gerhard Kuhn ,  Moritz Engl ,  Patrick Kromotis ,  Stefan Grötsch ,  Josef Hüttner ,  Mario Wanninger ,  Georg Bogner

发明人： Gerhard Kuhn ,  Moritz Engl ,  Patrick Kromotis ,  Stefan Grötsch ,  Josef Hüttner ,  Mario Wanninger ,  Georg Bogner

IPC分类号： H04N7/24

CPC分类号： G02B19/0066 ,  F21K9/00 ,  F21V17/101 ,  G02B19/0028 ,  G02B26/0833 ,  G02B27/0983 ,  G03B21/14 ,  G03B21/2033 ,  G03B21/208 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H04N9/315 ,  H01L2924/00

摘要： A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle α for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle β. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(β)·n2)≦N≦1.3·(AM·sin2(α))/(AD·sin2(β)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

摘要翻译： 一种投影装置，包括一个光调制器，该光调制器具有一个具有被照明的尺寸为AM的横截面积的光接收区域和用于入射光的最大接收角度α，以及至少一个光源， 其操作产生用于照射所述光接收区域的所述横截面积并包括数量N个具有最大辐射角＆lt; bgr的LED芯片的光锥。 至少一个LED芯片具有尺寸为AD的辐射去耦区域。 关系0.7·（AM·sin2（α））/（AD·sin2（＆bgr。）·n2）＆nlE; N＆nlE; 1.3·（AM·sin2（α））/（AD·sin2（＆bgr））·n2） 适用，其中n等于1或与提供LED芯片的耦合介质的折射率。

公开(公告)号：US08110437B2

公开(公告)日：2012-02-07

申请号：US10514461

申请日：2003-05-14

申请人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

发明人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L21/52 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

摘要翻译： 辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。 通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

公开(公告)号：US07948694B2

公开(公告)日：2011-05-24

申请号：US11574055

申请日：2005-08-02

申请人： Georg Bogner ,  Michael Hiegler ,  Monika Rose ,  Günter Waitl ,  Manfred Wolf

发明人： Georg Bogner ,  Michael Hiegler ,  Monika Rose ,  Günter Waitl ,  Manfred Wolf

IPC分类号： G02B7/02

CPC分类号： H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

摘要翻译： 规定了具有至少一个固定元件的装置，所述固定元件用于将所述装置固定到光电装置的壳体上，并且所述装置被设计为用于单独光学元件的安装件。

公开(公告)号：US07838357B2

公开(公告)日：2010-11-23

申请号：US10494160

申请日：2002-10-28

申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

IPC分类号： H01L218/8238

CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

公开(公告)号：US20100270578A1

公开(公告)日：2010-10-28

申请号：US12742064

申请日：2008-12-09

申请人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

发明人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

IPC分类号： H01L33/62 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.

摘要翻译： 发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。 作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

公开(公告)号：US20090001490A1

公开(公告)日：2009-01-01

申请号：US11658822

申请日：2005-07-21

申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis

发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis

IPC分类号： H01L31/0232 ,  H01L23/34 ,  H01L23/495

CPC分类号： H01L33/60 ,  F21S41/143 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 μm. In addition, an illumination module comprising such a component is disclosed.

摘要翻译： 一种发射电磁辐射的光电子部件，包括具有空腔的壳体，所述腔体形成沟槽状，并且在所述空腔中具有以线性排列布置的多个半导体芯片。 两个相邻的半导体芯片彼此之间具有小于或等于半导体芯片的一半半边缘长度并且大于或等于0μm的距离。 另外，公开了一种包括这种部件的照明模块。

公开(公告)号：US07429758B2

公开(公告)日：2008-09-30

申请号：US11141721

申请日：2005-05-31

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。