公开(公告)号：US09786535B2

公开(公告)日：2017-10-10

申请号：US14556233

申请日：2014-11-30

Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD.

Inventor： Hui-Ming Pao ,  Cheng-Hsin Chen ,  Po-Ting Lee ,  Ming-Chien Chiu ,  Tien-Jui Lin

IPC: B08B3/00 ,  H01L21/677 ,  H01L21/673 ,  H01L21/68 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67748 ,  H01L21/67259 ,  H01L21/67353 ,  H01L21/67393 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/687

Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.