公开(公告)号：US08829675B2

公开(公告)日：2014-09-09

申请号：US14083962

申请日：2013-11-19

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Vivian W. Ryan ,  Holm Geisler ,  Dirk Breuer

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/66 ,  H01L23/488

CPC classification number: H01L24/14 ,  H01L22/12 ,  H01L22/20 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/11009 ,  H01L2224/1184 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/742 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/3511 ,  H01L2924/3512 ,  Y10T29/53204 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A system for repairing pillar bumps includes a pillar bump repair device that is adapted to form a plurality of strain-relieving notches in a pillar bump that is positioned above a metallization system of a semiconductor chip. The system further includes a pillar bump support device that is adapted to substantially support the pillar bump while the pillar bump repair device is forming each of the plurality of strain-relieving notches.

Abstract translation: 用于修补柱状凸块的系统包括：柱凸块修复装置，其适于在位于半导体芯片的金属化系统上方的柱凸块中形成多个应变消除凹口。 该系统还包括一个支柱凸块支撑装置，该支柱凸块支撑装置适于在柱形凸起修复装置形成多个应变消除凹口中的每一个时基本上支撑柱形凸块。

公开(公告)号：US20140077368A1

公开(公告)日：2014-03-20

申请号：US14083962

申请日：2013-11-19

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Vivian W. Ryan ,  Holm Geisler ,  Dirk Breuer

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L22/12 ,  H01L22/20 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/11009 ,  H01L2224/1184 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/742 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/3511 ,  H01L2924/3512 ,  Y10T29/53204 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A system for repairing pillar bumps includes a pillar bump repair device that is adapted to form a plurality of strain-relieving notches in a pillar bump that is positioned above a metallization system of a semiconductor chip. The system further includes a pillar bump support device that is adapted to substantially support the pillar bump while the pillar bump repair device is forming each of the plurality of strain-relieving notches.

Abstract translation: 用于修补柱状凸块的系统包括：柱凸块修复装置，其适于在位于半导体芯片的金属化系统上方的柱凸块中形成多个应变消除凹口。 该系统还包括一个支柱凸块支撑装置，该支柱凸块支撑装置适于在柱形凸起修复装置形成多个应变消除凹口中的每一个时基本上支撑柱形凸块。