公开(公告)号：US08633574B2

公开(公告)日：2014-01-21

申请号：US13801505

申请日：2013-03-13

Applicant: General Electric Company

Inventor： Marc Schaepkens ,  Anil R. Duggal ,  Christian Maria Anton Heller

IPC: H01L23/58

CPC classification number: H01L51/5246 ,  H01L51/0097 ,  H01L51/5256 ,  H01L51/5259 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/31504

Abstract: Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.

Abstract translation: 有机电子封装具有密封边缘。 更具体地，提供了具有有机电子器件的封装。 提供多个密封机构以气密地密封包装的边缘，以将外部元件完全保护有机电子装置。 可以实现密封剂以完全围绕有机电子设备。 或者，可以提供边缘包裹以完全围绕有机电子设备。

公开(公告)号：US20130248828A1

公开(公告)日：2013-09-26

申请号：US13801505

申请日：2013-03-13

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Marc Schaepkens ,  Anil R. Duggal ,  Christian Maria Anton Heller

IPC: H01L51/52

CPC classification number: H01L51/5246 ,  H01L51/0097 ,  H01L51/5256 ,  H01L51/5259 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/31504

Abstract: Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.

Abstract translation: 有机电子封装具有密封边缘。 更具体地，提供了具有有机电子器件的封装。 提供多个密封机构以气密地密封包装的边缘，以将外部元件完全保护有机电子装置。 可以实现密封剂以完全围绕有机电子设备。 或者，可以提供边缘包裹以完全围绕有机电子设备。